DC Field | Value | Language |
---|---|---|
dc.contributor.author | Kim, Yoo-Sun | ko |
dc.contributor.author | Kim, Seung-Ho | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2019-04-15T21:10:43Z | - |
dc.date.available | 2019-04-15T21:10:43Z | - |
dc.date.created | 2013-06-25 | - |
dc.date.created | 2013-06-25 | - |
dc.date.created | 2013-06-25 | - |
dc.date.issued | 2013-05-29 | - |
dc.identifier.citation | The 63rd Electronic Components and Technology Conference, pp.1613 - 1616 | - |
dc.identifier.uri | http://hdl.handle.net/10203/258341 | - |
dc.language | English | - |
dc.publisher | The 63rd Electronic Components and Technology Conference | - |
dc.title | Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method | - |
dc.type | Conference | - |
dc.identifier.wosid | 000332764900245 | - |
dc.identifier.scopusid | 2-s2.0-84883344414 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 1613 | - |
dc.citation.endingpage | 1616 | - |
dc.citation.publicationname | The 63rd Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.doi | 10.1109/ECTC.2013.6575787 | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Kim, Yoo-Sun | - |
dc.contributor.nonIdAuthor | Kim, Seung-Ho | - |
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