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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Low Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method

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dc.contributor.authorKim, Yoo-Sunko
dc.contributor.authorKim, Seung-Hoko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2019-04-15T21:10:43Z-
dc.date.available2019-04-15T21:10:43Z-
dc.date.created2013-06-25-
dc.date.created2013-06-25-
dc.date.created2013-06-25-
dc.date.issued2013-05-29-
dc.identifier.citationThe 63rd Electronic Components and Technology Conference, pp.1613 - 1616-
dc.identifier.urihttp://hdl.handle.net/10203/258341-
dc.languageEnglish-
dc.publisherThe 63rd Electronic Components and Technology Conference-
dc.titleLow Temperature Camera Module Assembly Using Acrylic-based Solder ACFs with Ultrasonic-Assisted Thermo-Compression Bonding Method-
dc.typeConference-
dc.identifier.wosid000332764900245-
dc.identifier.scopusid2-s2.0-84883344414-
dc.type.rimsCONF-
dc.citation.beginningpage1613-
dc.citation.endingpage1616-
dc.citation.publicationnameThe 63rd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.doi10.1109/ECTC.2013.6575787-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorKim, Yoo-Sun-
dc.contributor.nonIdAuthorKim, Seung-Ho-
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