Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method
- Issue Date
- 2013-05-29
- Language
- English
- Citation
The 63rd Electronic Components and Technology Conference, pp.1709 - 1712
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
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