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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Fine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method

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dc.contributor.authorLee, Sang Hoonko
dc.contributor.authorSuk, Kyung Limko
dc.contributor.authorPaik, Kyung-Wookko
dc.date.accessioned2019-04-15T21:10:38Z-
dc.date.available2019-04-15T21:10:38Z-
dc.date.created2013-06-25-
dc.date.created2013-06-25-
dc.date.created2013-06-25-
dc.date.issued2013-05-29-
dc.identifier.citationThe 63rd Electronic Components and Technology Conference, pp.1709 - 1712-
dc.identifier.urihttp://hdl.handle.net/10203/258338-
dc.languageEnglish-
dc.publisherThe 63rd Electronic Components and Technology Conference-
dc.titleFine pitch flex-on-flex (FOF) assembly using nanofiber solder anisotropic conductive films (ACFs) and ultrasonic bonding method-
dc.typeConference-
dc.identifier.wosid000332764900262-
dc.identifier.scopusid2-s2.0-84883420536-
dc.type.rimsCONF-
dc.citation.beginningpage1709-
dc.citation.endingpage1712-
dc.citation.publicationnameThe 63rd Electronic Components and Technology Conference-
dc.identifier.conferencecountryUS-
dc.identifier.doi10.1109/ECTC.2013.6575804-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorLee, Sang Hoon-
dc.contributor.nonIdAuthorSuk, Kyung Lim-
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MS-Conference Papers(학술회의논문)
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