아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법(Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same)Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same
- Assignee
- KAIST
- Country
- US (United States)
- Issue Date
- 2016-06-28
- Application Date
- 2014-05-28
- Application Number
- 14288997
- Registration Date
- 2016-06-28
- Registration Number
- 9376541
- Appears in Collection
- MS-Patent(특허)
- Files in This Item
- There are no files associated with this item.
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