DC Field | Value | Language |
---|---|---|
dc.contributor.author | 백경욱 | ko |
dc.contributor.author | 강운병 | ko |
dc.contributor.author | 조태제 | ko |
dc.contributor.author | 서선경 | ko |
dc.contributor.author | 지영근 | ko |
dc.contributor.author | 신지원 | ko |
dc.contributor.author | 최용원 | ko |
dc.date.accessioned | 2019-04-15T16:40:30Z | - |
dc.date.available | 2019-04-15T16:40:30Z | - |
dc.date.issued | 2016-06-28 | - |
dc.identifier.uri | http://hdl.handle.net/10203/256131 | - |
dc.title | 아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법(Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same) | - |
dc.title.alternative | Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same | - |
dc.type | Patent | - |
dc.type.rims | PAT | - |
dc.contributor.localauthor | 백경욱 | - |
dc.contributor.nonIdAuthor | 강운병 | - |
dc.contributor.nonIdAuthor | 조태제 | - |
dc.contributor.nonIdAuthor | 서선경 | - |
dc.contributor.nonIdAuthor | 지영근 | - |
dc.contributor.nonIdAuthor | 신지원 | - |
dc.contributor.nonIdAuthor | 최용원 | - |
dc.contributor.assignee | KAIST | - |
dc.identifier.iprsType | 특허 | - |
dc.identifier.patentApplicationNumber | 14288997 | - |
dc.identifier.patentRegistrationNumber | 9376541 | - |
dc.date.application | 2014-05-28 | - |
dc.date.registration | 2016-06-28 | - |
dc.publisher.country | US | - |
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