아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법(Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same)Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same

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DC FieldValueLanguage
dc.contributor.author백경욱ko
dc.contributor.author강운병ko
dc.contributor.author조태제ko
dc.contributor.author서선경ko
dc.contributor.author지영근ko
dc.contributor.author신지원ko
dc.contributor.author최용원ko
dc.date.accessioned2019-04-15T16:40:30Z-
dc.date.available2019-04-15T16:40:30Z-
dc.date.issued2016-06-28-
dc.identifier.urihttp://hdl.handle.net/10203/256131-
dc.title아연 입자를 함유하는 비전도성 폴리머 막, 비전도성 폴리머 페이스트, 이들을 포함하는 반도체 패키지, 및 반도체 패키지의 제조 방법(Non-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same)-
dc.title.alternativeNon-conductive film comprising zinc particle, Non-conductive paste comprising zinc particle, semiconductor package comprising the same, and method of manufacturing the same-
dc.typePatent-
dc.type.rimsPAT-
dc.contributor.localauthor백경욱-
dc.contributor.nonIdAuthor강운병-
dc.contributor.nonIdAuthor조태제-
dc.contributor.nonIdAuthor서선경-
dc.contributor.nonIdAuthor지영근-
dc.contributor.nonIdAuthor신지원-
dc.contributor.nonIdAuthor최용원-
dc.contributor.assigneeKAIST-
dc.identifier.iprsType특허-
dc.identifier.patentApplicationNumber14288997-
dc.identifier.patentRegistrationNumber9376541-
dc.date.application2014-05-28-
dc.date.registration2016-06-28-
dc.publisher.countryUS-
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