Browse "GT-Conference Papers(학술회의논문)" by Author Ryu, Seunghun

Showing results 1 to 5 of 5

1
Contactless Interconnect Circuit Design for Automotive CAN Communication

Ryu, Seunghun; Kim, Haerim; Ahn, Jangyong; Ahn, Seungyoung; Kim, Jiseong, 2021 International Conference on Information and Communication Technology Convergence (ICTC), pp.65 - 68, IEEE, 2021-10-20

2
Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs

Lee, Seonghi; Kim, Hyun Woong; Park, Dongryul; Ahn, Jangyong; Ryu, Seunghun; Park, Gagyeong; Ahn, Seungyoung, 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-12-13

3
Separated Shielding Coil for Effective Shielding in Wireless Power Transfer System

Son, Seokhyoen; Woo, Seongho; Lee, Sanguk; Ryu, Seunghun; Choi, Semin; Ahn, Seungyoung, 2022 Wireless Power Week, WPW 2022, pp.640 - 643, Institute of Electrical and Electronics Engineers Inc., 2022-07

4
Signal Integrity Analysis of Notch-Routing to Reduce Near-End Crosstalk for Tightly Coupled and Short Microstrip Channel

Ryu, Seunghun; Kim, Hyun Woong; Lee, Seonghi; Park, Dongryul; Lee, Sanguk; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMC+SIPI 2023, pp.131 - 136, Institute of Electrical and Electronics Engineers Inc., 2023-08-01

5
Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

Kim, Hyun Woong; Park, Gagyeong; Ryu, Seunghun; Kim, Jongwook; Lee, Jaehoon; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.141 - 146, IEEE, 2023-07-29

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