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Showing results 1 to 4 of 4

1
Deep Reinforcement Learning-based Decoupling Capacitor Optimization Method for Multi-Power Domain considering Transfer Noise in 3D-ICs

Lee, Seonghi; Kim, Hyun Woong; Park, Dongryul; Ahn, Jangyong; Ryu, Seunghun; Park, Gagyeong; Ahn, Seungyoung, 2022 IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, Institute of Electrical and Electronics Engineers Inc., 2022-12-13

2
Double C-Shaped Reactive Shielding Coils for Low EMF and High Efficiency Wireless Power Transfer System

Lee, Sanguk; Woo, Seongho; Kim, Hongseok; Park, Gagyeong; Shin, Yujun; Son, Seokhyeon; Ahn, Seungyoung, 2022 Wireless Power Week, WPW 2022, pp.610 - 613, Institute of Electrical and Electronics Engineers Inc., 2022-07

3
Package design for signal integrity of low-power double data rate memory = 저전력 DDR 메모리의 신호 무결성을 위한 패키지 설계link

Park, Gagyeong; Ahn, Seungyoung; et al, 한국과학기술원, 2023

4
Signal Integrity Analysis of Wire Bonding Finger Capacitance to Reduce the Reflection of Multi-drop Topology for Low-Power Double Data Rate (LPDDR)

Kim, Hyun Woong; Park, Gagyeong; Ryu, Seunghun; Kim, Jongwook; Lee, Jaehoon; Ahn, Seungyoung, 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI), pp.141 - 146, IEEE, 2023-07-29

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