Effects of the Nylon Anchoring Polymer Layer on the Conductive Particle Movements of Anisotropic Conductive Films for Ultrafine Pitch Chip-on-Glass Applications

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Electronic packaging technology has become very important in electronic devices, because electrical interconnection problems such as high contact resistance and short-circuit failure have become serious issues in ultrafine pitch interconnection. In this paper, a nylon anchoring polymer layer (APL) structure has been introduced into the anisotropic conductive films (ACFs) system. Then, the effects of nylon APL properties on conductive particle movement of ACFs and its interconnection stability for ultrafine pitch chip-on-glass (COG) applications were investigated. The APL structure can significantly suppress the particles' movement for ultrafine pitch COG applications, and prevent the short-circuit problem between neighboring electrodes. After ACFs bonding process, the conductive particles capture rate of the conventional ACFs was 33%; however, that of the nylon APL ACFs showed 90%. In addition, the nylon APL ACFs showed excellent electrical interconnection properties such as stable contact resistances without any open or short-circuit failures. As a result, the nylon APL ACFs can be used as new interconnection materials for ultrafine pitch interconnection applications.
Publisher
IEEE-INST ELECTRICAL ELECTRONICS ENGINEERS INC
Issue Date
2018-10
Language
English
Article Type
Article
Citation

IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.10, pp.1723 - 1728

ISSN
2156-3950
DOI
10.1109/TCPMT.2018.2868514
URI
http://hdl.handle.net/10203/246543
Appears in Collection
MS-Journal Papers(저널논문)
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