Effects of Polymer Rebound on Crack-Free Acrylic based SnBi58 ACFs (Anisotropic Conductive Films) Joints during a Thermal-Compression Bonding Method

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Publisher
IEEE-CPMT
Issue Date
2017-05-31
Language
English
Citation

2017 IEEE 67th Electronic Components and Technology Conference

URI
http://hdl.handle.net/10203/223719
Appears in Collection
MS-Conference Papers(학술회의논문)
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