Effects of Polymer Rebound on Crack-Free Acrylic based SnBi58 ACFs (Anisotropic Conductive Films) Joints during a Thermal-Compression Bonding Method
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Zhang, Shuye | ko |
| dc.contributor.author | Paik, Kyung-Wook | ko |
| dc.date.accessioned | 2017-05-25T06:03:21Z | - |
| dc.date.available | 2017-05-25T06:03:21Z | - |
| dc.date.created | 2017-05-15 | - |
| dc.date.issued | 2017-05-31 | - |
| dc.identifier.citation | 2017 IEEE 67th Electronic Components and Technology Conference | - |
| dc.identifier.uri | http://hdl.handle.net/10203/223719 | - |
| dc.language | English | - |
| dc.publisher | IEEE-CPMT | - |
| dc.title | Effects of Polymer Rebound on Crack-Free Acrylic based SnBi58 ACFs (Anisotropic Conductive Films) Joints during a Thermal-Compression Bonding Method | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 2017 IEEE 67th Electronic Components and Technology Conference | - |
| dc.identifier.conferencecountry | US | - |
| dc.identifier.conferencelocation | Walt Disney Swan & Dolphin, Orlando, FL | - |
| dc.contributor.localauthor | Paik, Kyung-Wook | - |
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