A Study on the Flex-on- Fabric (FOF)Interconnections by Using Anisotropic ConductiveFilms (ACFs) with Ultrasonic Bonding Methods for Wearable Electronics Applications

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Publisher
The Korean Microelectronics and Packaging Society
Issue Date
2016-10-25
Language
English
Citation

15th International Symposium on Microelectronics and Packaging (ISMP 2016)

URI
http://hdl.handle.net/10203/213954
Appears in Collection
MS-Conference Papers(학술회의논문)
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