A Study on the Flex-on- Fabric (FOF)Interconnections by Using Anisotropic ConductiveFilms (ACFs) with Ultrasonic Bonding Methods for Wearable Electronics Applications
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Jung, Seung-Yoon | ko |
| dc.contributor.author | Hong, Hye Eun | ko |
| dc.contributor.author | Paik, Kyung Wook | ko |
| dc.date.accessioned | 2016-11-09T08:09:01Z | - |
| dc.date.available | 2016-11-09T08:09:01Z | - |
| dc.date.created | 2016-11-01 | - |
| dc.date.issued | 2016-10-25 | - |
| dc.identifier.citation | 15th International Symposium on Microelectronics and Packaging (ISMP 2016) | - |
| dc.identifier.uri | http://hdl.handle.net/10203/213954 | - |
| dc.language | English | - |
| dc.publisher | The Korean Microelectronics and Packaging Society | - |
| dc.title | A Study on the Flex-on- Fabric (FOF)Interconnections by Using Anisotropic ConductiveFilms (ACFs) with Ultrasonic Bonding Methods for Wearable Electronics Applications | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.publicationname | 15th International Symposium on Microelectronics and Packaging (ISMP 2016) | - |
| dc.identifier.conferencecountry | KO | - |
| dc.identifier.conferencelocation | Seoul, Korea | - |
| dc.contributor.localauthor | Paik, Kyung Wook | - |
| dc.contributor.nonIdAuthor | Hong, Hye Eun | - |
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