A Study on the Double layer Non Conductive Films (D-NCFs) For Highly Reliable Fine Pitch Flip ChipInterconnection

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Publisher
The Korean Microelectronics and Packaging Society
Issue Date
2016-10-25
Language
English
Citation

15th International Symposium on Microelectronics and Packaging (ISMP 2016)

URI
http://hdl.handle.net/10203/213953
Appears in Collection
MS-Conference Papers(학술회의논문)
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