DC Field | Value | Language |
---|---|---|
dc.contributor.author | Lee, Seyong | - |
dc.contributor.author | Paik, Kyung Wook | - |
dc.date.accessioned | 2016-11-09T08:08:49Z | - |
dc.date.available | 2016-11-09T08:08:49Z | - |
dc.date.created | 2016-11-01 | - |
dc.date.issued | 2016-10-25 | - |
dc.identifier.citation | 15th International Symposium on Microelectronics and Packaging (ISMP 2016) | - |
dc.identifier.uri | http://hdl.handle.net/10203/213953 | - |
dc.language | English | - |
dc.publisher | The Korean Microelectronics and Packaging Society | - |
dc.title | A Study on the Double layer Non Conductive Films (D-NCFs) For Highly Reliable Fine Pitch Flip ChipInterconnection | - |
dc.type | Conference | - |
dc.type.rims | CONF | - |
dc.citation.publicationname | 15th International Symposium on Microelectronics and Packaging (ISMP 2016) | - |
dc.identifier.conferencecountry | KO | - |
dc.identifier.conferencelocation | Seoul, Korea | - |
dc.contributor.localauthor | Paik, Kyung Wook | - |
dc.contributor.nonIdAuthor | Lee, Seyong | - |
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