Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 6481 to 6540 of 22776
| Depth compression of 3D object represented by layered depth image Park, S.-Y.; Kim, Seong-Dae, Data Compression Conference, DCC 2010, pp.504 - 513, Data Compression Conference, DCC 2010, 2010-03-24 |
| Depth enhancement of integral imaging AR display with an electrowetting microlens array Kim, Cheoljoong; Shin, Dooseub; Koo, Gyohyun; Won, Yong Hyub, Conference on Advances in Display Technologies X, SPIE-INT SOC OPTICAL ENGINEERING, 2020-02 |
| Depth Estimation From a Single Image Using Salient Objects Detection Lee, Jaeho; Yoo, Seungwoo; Kang, Mintae; Chon, Changhwan; Kim, Changick, International Conference on 3D Systems and Applications (3DSA) , pp.283 - 286, 3DIDA of Taiwan, URCF of Japan and ARMI of Korea, 2012-06-26 |
| Depth estimation from a single image with a communication module between global network and local network Jeong, Minki; Kim, Chang-Ick, International Conference on 3D Systems and Applications, Association of Realistic Media Industry(ARMI), 2017-08-31 |
| Depth Estimation from Light Field Cameras Im, Sung Hoon; Jeon, Hae Gon; Ha, Hyo Won; Kweon, In So, The 12th International Conference on Ubiquitous Robots and Ambient Intelligence, KROS, 2015-10-29 |
| Depth extraction using adaptive blur channel selection for dual aperture camera Kim, Kyungho; Lee, Yeongmin; Park, Hyun Sang; Kyung, Chong-Min, 2016 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2016, pp.198 - 201, Institute of Electrical and Electronics Engineers Inc., 2016-10 |
| Depth from accidental motion using geometry prior Im, Sunghoon; Kweon, In-So; Choe, Gyeongmin; Jeon, Hae-Gon, IEEE International Conference on Image Processing, IEEE Signal Processing Society, 2015-10-29 |
| Depth from Camera Motion in Robot Vision 변증남, 대한전기학회 제어계측시스템연구회학술회의, pp.10 - 12, 1985 |
| Depth Map Estimation Based on Geometric Scene Categorization Lee, Hyukzae; Jung, Chanho; Kim, Changick, Korea-Japan Joint Workshop on Frontiers of Computer Vision, pp.170 - 173, IEEE, 2013-01-31 |
| Depth map generation from a single image by using a cascade of deep network Kim, Jinsu; Kim, Chang-Ick, Three Dimensional Systems and Applications, Association of Realistic Media Industry, 2017-08-29 |
| Depth refinement on sparse-depth images using visual perception cues Khan, Muhammad Umar Karim; Khan, Asim; Kyung, Chong-Min, 2016 IEEE Asia Pacific Conference on Circuits and Systems, APCCAS 2016, pp.440 - 443, Institute of Electrical and Electronics Engineers Inc., 2016-10 |
| Depth-based Disocclusion Filling for Virtual View Synthesis Ahn, Ilkoo; Kim, Changick, IEEE International Conference on Multimedia & Expo (ICME), pp.109 - 114, IEEE, 2012-07 |
| Depth-enhanced integral imaging display system with time-multiplexed depth planes using a varifocal liquid lens array Kim, Cheoljoong; Lee, Muyoung; Kim, Junoh; Lee, Jin Su; Won, Yong Hyub, Conference on Advances in Display Technologies V, SPIE, 2015-02-08 |
| Depth-estimation for visual servoing based on fuzzy logic Bien, Zeung nam; Park J., Proceedings of the 1996 5th IEEE International Conference on Fuzzy Systems. Part 3 (of 3), v.2, pp.1043 - 1047, 1996-09-08 |
| Depth-Hybrid Speeded-Up Robust Features Kim, Hyungjjin; Lee, Donghwa; Myung, Hyun, Int'l Conf. on Control, Automation and Systems (ICCAS), Institute of Control, Robotics and Systems, 2017-10-18 |
| Dereverberation based on deep neural networks using acoustic intensity 유정민; 최정우; 조병호; 전세운, 2019년도 추계 소음진동학술대회, 한국소음진동공학회, 2019-10-25 |
| Dereverberation Based on Deep Neural Networks with Directional Feature from Spherical Microphone Array Recordings Liu, Jeongmin; Choi, Jung-Woo; Jo, Byeongho, International Congress on Acoustics, International Commission for Acoustics (ICA), 2019-09-12 |
| Derivation of the closed-form PDF of the downlink SIR for coexisting LTE systems Kim, M; Son, H; Lee, HyuckJae, Personal Indoor and Mobile Radio Communications (PIMRC), 2012 IEEE 23rd International Symposium on, pp.1390 - 1394, IEEE, 2012-09-12 |
| Derivations of decoder and beamforming vector for amplify-and-forward relays based on the Cauchy-Schwartz inequality Kim, S.; Kim, J.; Choi, W.-C.; Park, Dong-Jo, 2009 9th International Symposium on Communications and Information Technology, ISCIT 2009, pp.518 - 519, IEEE, 2009-09-28 |
| Derivstions of Decoder and Beamforming Vector for Amplify-and-Forward Relays Based on the Cauchy-Schwartz Inequality Park, Dong-Jo; Kim, S; Kim, J; Choi, WC, IEEE International Symposium on Communication and Information Technology, pp.518 - 519, 2009 |
| Desgin of Multiobjective Satisfactory Fuzzy Logic Controller Using Reinforcement Learning Bien, Zeung nam, International Technical Conference on Circuits/Systems, Computers and Communications, 2000 |
| Design of efficient organic pulse oximetry sensors Lee, Hyeon Woo; Kim, Eunhye; Kim, Min-Cheol; Yoo, Seunghyup, The 10th Asian Conference on Organic Electronics, City University of Hong Kong, Hong Kong, 2018-12-07 |
| Design & Simulation of Dual-mode VCOs for PCS/IMT-2000 Applications Yoon, Giwan, 3rd Topical Symposium on Millimeter Waves, pp.171 - 174, 2001-03 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Design and analysis of an active simultaneously switching output noise reduction scheme Park, Shinyoung; Kim, Subin; Shin, Taein; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.222 - 225, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of Chip-level Wireless Power Transfer Using Magnetic-field Resonance Coupling and 0.18 um CMOS Technology Kim, Joungho; Song, Jinwook; Jeong, Seungtaek; Park, Shinyoung, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System Sim, BooGyo; Jeong, Seung Taek; Lee, Seongsoo; Hong, Seokwoo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.639 - 643, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
| Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System Lee, Seongsoo; Jeong, Seungtaek; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), 2018-06-05 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; et al, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Design and Analysis of Hybrid Loop-array for High Efficiency and Low EMF Level in Wireless High Power Transfer System Kim, Joungho; Lee, Seongsoo; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of LTE MIMO Handset Antenna with Enhanced Isolation using Decoupling Technique Park, SeongOok, 2009 International Symposium on Antennas and Propagation, 2009-10-20 |
| Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC Kim, Joungho, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2014-12-15 |
| Design and analysis of on-interposer active power distribution network for an efficient simultaneous switching noise suppression in 2.5D IC Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Kim, Joungho, IEEE International 3D Systems Integration Conference, 3DIC 2016, Institute of Electrical and Electronics Engineers Inc., 2017-11 |
| Design and Analysis of On-interposer Active Power Dsitribution Network for an Efficient Simultaneous Switching Noise Kim, Joungho; Cho, Kyungjun; Song, Jinwook, IEEE International Conference on 3D Systems Integration (3D IC 2016), IEEE International Conference on 3D Systems Integration (3D IC 2016), 2016-11-11 |
| Design and Analysis of On-package Inductor of an Integrated Voltage Regulator for High-Q Factor and EMI Shielding in Active Interposer based 2.5D/3D ICs Kim, Subin; Jeong, Seungtaek; Sim, Boogyo; Lee, Seongsoo; Park, Hyunwook; Kim, Haeyeon; Kim, Joungho, 2021 IEEE International Joint EMC/SI/PI and EMC Europe Symposium, pp.498 - 503, IEEE, 2021-07-26 |
| Design and Analysis of Power Distribution Network (PDN) for High Bandwidth Memory (HBM) Interposer in 2.5D Terabyte/s Bandwidth Graphics Module Kim, Joungho; Cho, Kyungjun; Kim, Youngwoo; Lee, Hyungsuk; Kim, Heegon; Cho, Sumin; Kim, Subin, 66th Electronic Components and Technology Conference (ECTC), 66th Electronic Components and Technology Conference (ECTC), 2016-06-01 |
| Design and Analysis of Receiver Channels of Glass Interposer for Dual Band Wi-Fi Front End Module (FEM) Kim, Joungho; Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Kim, Minsuk; Pulugurtha Markondeya Raj; Venky Sundaram; et al, IEEE International Symposium on Electromagnetic Compatibility, IEEE International Symposium on Electromagnetic Compatibility, 2017-08-09 |
| Design and Analysis of Receiver Channels of Glass Interposers for 5G Small Cell Front End Module Park, Gapyeol; Kim, Youngwoo; Cho, Kyungjun; Park, Junyong; Son, Kyungjune; Park, Hyunwook; Kim, Joungho; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.107 - 109, IEEE, 2018-10-15 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Park, Junyong; Kim, Heegon; Bae, Bumhee; Jung, Daniel H; Ha, Dongho; et al, DesignCon 2016, DesignCon 2016, 2016-01-19 |
| Design and Analysis of Silicone Rubber-based TERAPOSER for LPDDR4 Memory Test Kim, Jonghoon J; Kim, Joungho; Kim, Hee-Gon; Jung, Daniel Hyunsuk; Choi, Sumin; Lim, Jaemin; Park, Junyong; et al, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.450 - 454, Institute of Electrical and Electronics Engineers Inc, 2016-07-27 |
| Design and Analysis of Thermal Transmission Line based Embedded Cooling Structures for High Bandwidth Memory Module and 2.5D/3D ICs Son, Keeyoung; Kim, Subin; Park, Shinyoung; Park, Hyunwook; Kim, Keunwoo; Shin, Taein; Kim, Minsu; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2020, Institute of Electrical and Electronics Engineers Inc., 2020-12 |
| Design and Analysis of Wireless Power Transfer System using Flexible Coil and Shielding Material on Smartwatch Strap Kim, Joungho; Jeong, Seungtaek; Song, Jinwook; Kim, Hongseok; Lee, Seongsoo, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-11 |
| Design and Assembly of Colloidal Quantum-dot-based Three-dimensional Optical Nanostructures Kim, Geon Yeong; Kim, Shinho; Jang, Min Seok; Jung, Yeon Sik, 2023 MRS Spring Meeting & Exhibit, Mateiral Research Society (MRS), 2023-04-13 |
| Design and Characterization of Magnetically Coupled On-Chip Current Probe for Monitoring Switching Current in Chip I/O PDN Kim, Joungho; Jonghoon J. Kim; Jun So Pak, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12 |
| Design and control of a dc-dc converter for electric vehicle applications Youn, Myung Joong; Kang, JI; Roh, CW; Lee, SS; Moon, GW, 전력전자학술대회 , pp.754 - 758, 전력전자학회, 2002-07 |
| Design and Convergence of Neural Network-based Self-Tuning Regulator for Partially Known Nonlinear Dynamical System Bien, Zeung nam, Proceedings of SICE, pp.1149 - 1152, 1993 |
| Design and estimation of embedded passives in multiple line grid array (MLGA) package Kim, Joungho; Lee, Junho; Ahn, Seungyoung; Baek, Seungyong; Kim, Young-Soo; Yoon, Chong K., EMAP2000, EMAP, 2000-11 |
| Design and Evaluation of a PIFA Array for MIMO-Enabled Portable Wireless Communication Devices Park, SeongOok; Bhatti, Rashid A.; Choi, Mingoo; Choi, Jang-Hwan, IEEE Antenna and Propagation Symposium 2008, 2008-07-12 |
| Design and Evaluation of mmWave Backscatter Tag System for Internet of Things Applications Muin, Fathul; Park, Seong-Ook; Hariyadi, Tommi, XXXVth URSI General Assembly and Scientific Symposium, Japan National Committee of URSI (JNC-URSI), 2023-08-24 |
| Design and Fabrication of a Novel Inner Field-plate AlGaN/GaN-HEMT Structure for High Power Applications Lee,; Lee, S; Yang, Kyounghoon, MINT-MIS, pp.205 - 208, 2007 |
| Design and Fabrication of a VCO Integrated with Microstrip Patch Antenna Myung, Noh-Hoon; Hwang, JH, Asia-Pacific Microwave Conference, pp.265 - 269, 1995 |
| Design and fabrication of Ge-on-Si slot waveguide for mid- infrared optical gas sensor Lim, Jinha; Shim, Joonsup; Kim, Sanghyeon, OSA Optical Sensors and Sensing Congress 2021, Optical Society of America, 2021-07 |
| Design and Fabrication of Micro-energy Harvesters Based on Multilayered Piezoelectric Thin Films Yoon, Chongsei; Ha, Jae Kwon; Yoon, Giwan, IUMRS-ICEM 2018, International Union of Materials Research Societies, The Materials Research Society of Korea, 2018-08-20 |
| Design and fabrication of micromachined internal combustion engine as a power source for microsystems Park, D.-E.; Lee, D.-H.; Yoon, Jun-Bo; Kwon, Sejin; Yoon, Euisik, 15th IEEE International Conference on Micro Electro Mechanical Systems MEMS 2002, pp.272 - 275, 2002-01-20 |
Discover
Open Access
- 573 OA Article
Date issued
- 4,909 2020 - 2024
- 18,937 2010 - 2019
- 15,019 2000 - 2009
- 7,644 1990 - 1999
- 2,391 1980 - 1989