Showing results 25601 to 25620 of 51077
Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package Shim, Yujeong; Park, Jongbae; Kim, Jaemin; Song, Eakhwan; Yoo, Jeongsik; Pak, Junso; Kim, Joungho, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, Vol.51, No.3, pp.763-773, 2009-08 |
Modeling and Analysis of Simultaneous Switching Noise Effects on Jitter Characteristics of Delay Locked Loop and Serial Link in a Hierarchical System of Chip, Package and PCB = 칩, 패키지, 피씨비로 구성된 시스템에서 동시 스위칭 노이즈가 DLL과 직렬 통신 시스템의 지터 특성에 미치는 영향에 대한 모델링과 분석link Shim, Yu-Jeong; 심유정; et al, 한국과학기술원, 2011 |
Modeling and analysis of static and dynamic characteristics for buck-type three-phase PWM rectifier by circuit DQ transformation Han, SB; Choi, NS; Rim, Chuntaek; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON POWER ELECTRONICS, v.13, no.2, pp.323 - 336, 1998-03 |
Modeling and Analysis of System-Level Power Supply Noise Induced Jitter (PSIJ) for 4 Gbps High Bandwidth Memory (HBM) I/O Interface Shin, TaeIn; Kim, Joungho; Park, Hyunwook; Kim, Keunwoo; Kim, SeongGuk; Son, Keeyoung; Park, Gap Yeol; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2021, IEEE, 2021-12-13 |
Modeling and Analysis of Through-Silicon Via (TSV) Noise Coupling and Suppression Using a Guard Ring Cho, Jong-Hyun; Song, Eak-Hwan; Yoon, Ki-Hyun; Pak, Jun-So; Kim, Joo-Hee; Lee, Woo-Jin; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.220 - 233, 2011-02 |
Modeling and analysis of TSV noise coupling effects on active circuits and shielding structures in 2.5D/3D IC = 2.5/3차원 집적회로에서 실리콘 관통 비아의 잡음전달이 능동회로에 미치는 영향에 대한 모델링 및 분석과 차폐에 대한 연구link Lim, Jaemin; Kim, Joungho; et al, 한국과학기술원, 2019 |
Modeling and Analysis of TSV Noise Coupling Effects on RF LC-VCO and Shielding Structures in 3D IC Lim, Jaemin; Cho, Jonghyun; Jung, Daniel Hyunsuk; Kim, Jonghoon J.; Choi, Sumin; Kim, Dong-Hyun; Lee, Man Ho; et al, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.60, no.6, pp.1939 - 1947, 2018-12 |
Modeling and Analysis of Wireless LAN Traffic Yamkhin, Dashdorj; Won, Youjip, JOURNAL OF INFORMATION SCIENCE AND ENGINEERING, v.25, no.6, pp.1783 - 1801, 2009-11 |
Modeling and Analysis of Wireless LANs with a Backoff Freezing Mechanism Hwang, Ho Young; Kim, Seong Joon; Kim, Byung-Soo; Sung, Dan Keun; Park, Suwon; Chung, Young-uk, INFORMATION-AN INTERNATIONAL INTERDISCIPLINARY JOURNAL, v.15, no.3, pp.1081 - 1094, 2012-03 |
MODELING AND AUTOMATIC-CONTROL OF COLOR PICTURE TUBE ADJUSTMENT PROCESS KIM, SR; CHUNG, TS; Bien, Zeung nam, CONTROL ENGINEERING PRACTICE, v.2, no.1, pp.17 - 29, 1994-02 |
Modeling and Autopilot Design of Blended Wing-Body UAV Min, Byoung-Mun; Shin, Sung-Sik; Shim, Hyun-Chul; Tahk, Min-Jea, INTERNATIONAL JOURNAL OF AERONAUTICAL AND SPACE SCIENCES , v.9, no.1, pp.121 - 128, 2008-05 |
Modeling and characterization of gas-phase etching of thermal oxide and TEOS oxide using anhydrous HF and CH3OH Lee, CS; Baek, JT; Yoo, Hyung Joun; Woo, Seong-Ihl, JOURNAL OF THE ELECTROCHEMICAL SOCIETY, v.143, no.3, pp.1099 - 1103, 1996-03 |
Modeling and Characterization of the Detection and Suppression of Bogus Messages in Vehicular Ad Hoc Networks Ding, Qing; Wang, Jianfeng; Zhang, Xinming; Sung, Dan Keun, IEEE TRANSACTIONS ON MOBILE COMPUTING, v.22, no.10, pp.6027 - 6040, 2023-10 |
Modeling and characterization of Zinc Oxide thin film transistors = ZnO 박막트랜지스터의 특성화 및 모델링link Jang, Jin-Hyuk; 장진혁; et al, 한국과학기술원, 2009 |
Modeling and circuit design for intra-body power transfer = 체내전력전송을 위한 모델링과 회로 설계link Cho, Hyungjoo; Je, Minkyu; et al, 한국과학기술원, 2019 |
Modeling and computer simulation of ultrasound imaging systems and human tissue = 초음파 영상시스템 및 인체조직에 관한 모델링 및 컴퓨터 시뮬레이션link Lee, Bum-Suk; 이범석; et al, 한국과학기술원, 1989 |
Modeling and Demonstration of Hardware-based Deep Neural Network (DNN) Inference using Memristor Crossbar Array considering Signal Integrity Shin, Taein; Park, Shinyoung; Kim, Seongguk; Park, Hyunwook; Lho, Daehwan; Kim, Subin; Son, Kyungjune; et al, IEEE International Symposium on Electromagnetic Compatibility and Signal/Power Integrity, EMCSI 2020, pp.417 - 421, Institute of Electrical and Electronics Engineers Inc., 2020-07 |
Modeling and design of BGA type package for low inductance power/ground impedance and simultaneous switching noise = 전력 및 접지면에서 낮은 임피던스와 잡음을 갖는 볼 격자 배열 타입 패키지를 구현하기 위한 모델링과 디자인 방법에 관한 연구link Choi, Su-Na; 최수나; et al, 한국과학기술원, 2004 |
Modeling and design of flexible PCB coils and reliability study for flexible wireless power transfer systems = 유연한 무선 전력 전송 시스템을 위한 유연 PCB 코일의 모델링, 디자인 및 신뢰성 연구link Jeong, Seungtaek; Kim, Joungho; et al, 한국과학기술원, 2020 |
Modeling and Design of Multi-loop Controlled Series Regulator Kim, MG; Choi, HC; Youn, Myung Joong, pp.335 - 340, 1991-10 |
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