Modeling and Analysis of Simultaneous Switching Noise Coupling for a CMOS Negative-Feedback Operational Amplifier in System-in-Package

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 734
  • Download : 1586
A new hybrid modeling method is proposed for the chip–package comodeling and coanalysis. This method is designed to investigate the simultaneous switching noise (SSN) coupling paths and effects on the dc output voltage offset of the operational amplifier (OpAmp). It combines an analytical model of the circuit with a power distributed network (PDN) and interconnection models at the chip and package substrate. In order to validate the proposed model, CMOS OpAmp was fabricated using TSMC 0.25 μm. Then the dc output offset voltage of the OpAmp was measured by sweeping the SSN frequency from 10 MHz up to 3 GHz. It was successfully demonstrated that the experimental results are consistent with the predictions generated using the proposedmodel. We also confirmed that the dc offset voltage is strongly dependent on the SSN frequency and the PDN impedance profile of the chip–package hierarchical PDN. It shows the necessity for the chip–package comodeling and simulation of the system-in-package designs.
Publisher
IEEE
Issue Date
2009-08
Keywords

Circuit modeling; electromagnetic noise; impedance matrix; operational amplifiers; power distribution lines; power distribution noise

Citation

IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, Vol.51, No.3, pp.763-773

ISSN
0018-9375
DOI
10.1109/TEMC.2009.2026637
URI
http://hdl.handle.net/10203/16974
Appears in Collection
EE-Journal Papers(저널논문)
Files in This Item
[Pub-Aug_2009] 심유정.pdf(1.12 MB)Download

qr_code

  • mendeley

    citeulike


rss_1.0 rss_2.0 atom_1.0