Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 12501 to 12520 of 22768
| Model-based multiobjective fuzzy control using a new multiobjective dynamic programming approach Kang D.-O.; Bien, Zeung nam, Joint 9th IFSA World Congress and 20th NAFIPS International Conference, pp.1390 - 1395, NAFIPS, 2001-07-25 |
| Model-Based Object Recognition by Maximization of Combined Mutual Information of Intensity and Orientation Ra, Jong Beom; Kim, YS; Lee, JH, , 2006-07 |
| Model-based path planning and tracking control using neural networks for a robot manipulator Park Sangbong; Park, Cheol Hoon, Proceedings of the 1997 IEEE International Conference on Neural Networks. Part 4 (of 4), v.3, pp.1761 - 1765, 1997-06-09 |
| Model-based Video Interpretation using Static and Temporal Context Kweon, In-So; Kim, Sungho, Korea-Japan Joint Workshop on Frontiers of Computer Vision(FCV), 2006-02 |
| Model-free joint torque control strategy for hydraulic robots Lee, Woongyong; Kim, Min Jun; Chung, Wan Kyun, IEEE International Conference on Robotics and Automation (ICRA) 2016, pp.2408 - 2415, IEEE Robotics and Automation Society, 2016-05-18 |
| Model-Free Unsupervised Anomaly Detection of a General Robotic System Using a Stacked LSTM and Its Application to a Fixed-Wing Unmanned Aerial Vehicle Park, JaeHyeon; Shanbhag, Soham; Chang, Dong Eui, 2022 IEEE/RSJ International Conference on Intelligent Robots and Systems (IROS 2022) , pp.4287 - 4293, IEEE Robotics and Automation Society, 2022-10 |
| Modeling Analysis and Control of Static Var Compensator Using Three-Level Inverter Cho, Gyu-Hyeong, IEEE IAS Rec, pp.837 - 843, IEEE, 1992-10 |
| Modeling and analysis for the coexistence of PSC I and PSC II in the IEEE 802.16e system Kwon, Sang Wook; Cho, Dong-Ho, 2010 IEEE 21st International Symposium on Personal Indoor and Mobile Radio Communications, PIMRC 2010, pp.1487 - 1492, IEEE, 2010-09-26 |
| Modeling and analysis of a conductive rubber contactor for package test Kim, Hyesoo; Bae, Bumhee; Kim, Jonghoon J; Park, Junyong; Ha, Dongho; Bae, Michael; Kim, Joungho, 17th IEEE Electronics Packaging and Technology Conference, EPTC 2015, Institute of Electrical and Electronics Engineers Inc., 2015-12 |
| Modeling and Analysis of a Nonlinear Elastomer Impact Model with Damping Mechanism Sung, Dan Keun, IECON, pp.609 - 612, 1991 |
| Modeling and analysis of a static var compensator using multilevel voltage source inverter Choi, Nam S.; Cho, Guk C.; Cho, Gyu-Hyeong, Proceedings of the 28th Annual Meeting of the IEEE Industry Applications Conference, v.2, pp.901 - 908, 1993-10-03 |
| Modeling and analysis of an energy-efficient sleep-mode operation in IEEE 802.16e system Chu,EM; Jung, BH; Sung, Dan Keun; Park, YJ, IEEE ICC 2012, IEEE, 2012-06 |
| Modeling and analysis of Buck-type three phase PWM rectifier by circuit DQ transformation Han, Soo-Bin; Choi, Nam-Sup; Rim, Chuntaek; Cho, Gyu-Hyeong, Power Electronics Specialists Conference, 1995. PESC '95 Record., 26th Annual IEEE, pp.431 - 436, IEEE, 1995-06 |
| Modeling and Analysis of CDMA Soft Handoff Sung, Dan Keun; Park, S; Cho, HS, IEEE Vehicular Technology Conference, pp.1525 - 1529, 1996 |
| Modeling and analysis of combined mobility management based on implicit cell update scheme in general packet radio service Chung, Y.W.; Sung, Dan Keun, 57th IEEE Semiannual Vehicular Technology Conference (VTC2003), v.57, no.1, pp.160 - 164, 2003-04-22 |
| Modeling and analysis of coupling between TSVs, metal, and RDL interconnects in TSV-based 3D IC with silicon interposer Yoon, K.; Kim, G.; Lee, W.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.702 - 706, 2009-12-09 |
| Modeling and Analysis of Defects in Through Silicon Via Channel for Non-invasive Fault Isolation Kim, Joungho; Kim, Heegon; Kim, Jonghoon J; Kim, Sukjin; Bae, Hyun-Cheol; Choi, Kwang-Seong, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Modeling and analysis of die-to-die vertical coupling in 3-D IC Lee, S.; Kim, G.; Kim, J.; Song, T.; Lee, J.; Lee, H.; Park, K.; et al, 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.707 - 711, 2009-12-09 |
| Modeling and analysis of differential signal Through Silicon Via (TSV) in 3D IC Kim, J.; Pak, J.S.; Cho, J.; Lee, J.; Lee, H.; Park, K.; Kim, Joungho, 2010 IEEE CPMT Symposium Japan, ICSJ10, IEEE, 2010-08-24 |
| Modeling and Analysis of High-Speed Through Silicon Via (TSV) Channel and Defects Jung, Daniel H; Kim, Joungho; Kim, Jonghoon J; Kim, Heegon; Choi, Sumin; Lim, Jaemin; Bae, Hyun-Cheol; et al, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), pp.430 - 433, 2016 IEEE International Conference on Signal and Power Integrity (SIPI 2016), 2016-07-27 |
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