Browse "School of Electrical Engineering(전기및전자공학부)" by Type Article
Showing results 6681 to 6700 of 14319
| HIGH-FIELD BREAKDOWN IN THIN OXIDES GROWN IN N2O AMBIENT JOSHI, AB; Yoon, Giwan; KIM, JH; LO, GQ; KWONG, DL, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.40, no.8, pp.1437 - 1445, 1993-08 |
| High-Field Electron Transport and High Saturation Velocity in Multilayer Indium Selenide Transistors Seok, Yongwook; Jang, Hanbyeol; Choi, Yitaek; Ko, Yeonghyeon; Kim, Minje; Im, Heungsoon; Watanabe, Kenji; et al, ACS NANO, v.18, no.11, pp.8099 - 8106, 2024-03 |
| High-field magnetic resonance techniques for brain research Kim, Dae-Shik; Garwood, M, CURRENT OPINION IN NEUROBIOLOGY, v.13, no.5, pp.612 - 619, 2003-10 |
| HIGH-FIELD-INDUCED LEAKAGE IN ULTRATHIN N2O OXIDES Yoon, Giwan; JOSHI, AB; KIM, J; KWONG, DL, IEEE ELECTRON DEVICE LETTERS, v.14, no.5, pp.231 - 233, 1993-05 |
| High-finesse AlxOy/AlGaAs nonabsorbing optical cavity Shin, HE; Ju, YG; Song, HW; Song, DS; Han, IY; Ser, JH; Ryu, HY; et al, APPLIED PHYSICS LETTERS, v.72, no.18, pp.2205 - 2207, 1998-05 |
| High-Frequency Electrical Characterization of a New Coaxial Silicone Rubber Socket for High-Bandwidth and High-Density Package Test Park, Junyong; Kim, Hyesoo; Kim, Jonghoon J.; Kim, DongHyun; Son, Kyungjune; Kim, Subin; Lee, Seongsoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.8, no.12, pp.2152 - 2162, 2018-12 |
| High-Frequency Modeling and Signal Integrity Analysis of a Silicone Rubber Socket for High-Performance Package Kim, Hyesoo; Kim, Jonghoon J.; Park, Junyong; Park, Shinyoung; Choi, Sumin; Bae, Bumhee; Ha, DongHo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.7, no.8, pp.1356 - 1368, 2017-08 |
| High-frequency on-chip inductance model Sim, SP; Lee, Kwyro; Yang, CY, IEEE ELECTRON DEVICE LETTERS, v.23, no.12, pp.740 - 742, 2002-12 |
| HIGH-FREQUENCY RESONANT AC/DC RECTIFIER WITH UNITY POWER-FACTOR CHOI, HC; HAN, JW; Youn, Myung Joong, ELECTRONICS LETTERS, v.28, no.17, pp.1592 - 1594, 1992-08 |
| High-Frequency Scalable Electrical Model and Analysis of a Through Silicon Via (TSV) Kim, Joo-Hee; Pak, Jun-So; Cho, Jong-Hyun; Song, Eak-Hwan; Cho, Jeong-Hyeon; Kim, Hee-Gon; Song, Tai-Gon; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.1, no.2, pp.181 - 195, 2011-02 |
| High-Frequency Scalable Modeling and Analysis of a Differential Signal Through-Silicon Via Kim, Joo-Hee; Cho, Jong-Hyun; Kim, Joungho; Yook, Jong-Min; Kim, Jun Chul; Lee, Junho; Park, Kunwoo; et al, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.4, no.4, pp.697 - 707, 2014-04 |
| High-frequency SPICE model of anisotropic conductive film flip-chip interconnections based on a genetic algorithm Ryu, Woonghwan; Yim, Myung-Jin; Ahn, Seungyoung; Lee, Junho; Kim, Woopoung; Paik, Kyung-Wook; Kim, Joungho, IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, v.23, no.3, pp.542 - 545, 2000-09 |
| High-Frequency Temperature-Dependent Through-Silicon-Via (TSV) Model and High-Speed Channel Performance for 3-D ICs Lee, Man Ho; Jung, Daniel Hyunsuk; Kim, Hee-Gon; Cho, Jong-Hyun; Kim, Joungho, IEEE DESIGN & TEST OF COMPUTERS, v.33, no.2, pp.17 - 29, 2016-03 |
| High-gain coefficient long-wavelength-band erbium-doped fiber amplifier using 1530-nm band pump Choi, BH; Park, HyoHoon; Chu, M; Kim, SK, IEEE PHOTONICS TECHNOLOGY LETTERS, v.13, no.2, pp.109 - 111, 2001-02 |
| High-Gain Wide-Bandwidth Capacitor-Less Low-Dropout Regulator (LDO) for Mobile Applications Utilizing Frequency Response of Multiple Feedback Loops Hong, Sung Wan; Cho, Gyu-Hyeong, IEEE TRANSACTIONS ON CIRCUITS AND SYSTEMS I-REGULAR PAPERS, v.63, no.1, pp.46 - 57, 2016-01 |
| High-k HfxZr1-xO2 Ferroelectric Insulator by Utilizing High Pressure Anneal Das, Dipjyoti; Jeon, Sanghun, IEEE TRANSACTIONS ON ELECTRON DEVICES, v.67, no.6, pp.2489 - 2494, 2020-06 |
| High-Level Architecture service management for the interoperation of federations Yoo, Min Wook; Choi, Changbeom; Kim, Tag-Gon, SIMULATION-TRANSACTIONS OF THE SOCIETY FOR MODELING AND SIMULATION INTERNATIONAL, v.91, no.6, pp.566 - 590, 2015-06 |
| High-Linearity In-Pixel Thermal Sensor Using Low-Temperature Poly-Si Thin-Film Transistors Kim, Hyun-Sik; Han, Kwan-Young, IEEE SENSORS JOURNAL, v.15, no.2, pp.963 - 970, 2015-02 |
| High-Linearity K-Band Absorptive-Type MMIC Switch Using GaN PIN-Diodes Yang, Jung-Gil; Yang, Kyoung-Hoon, IEEE MICROWAVE AND WIRELESS COMPONENTS LETTERS, v.23, no.1, pp.37 - 39, 2013-01 |
| High-Order Modulation Based on Deep Neural Network for Physical-Layer Network Coding Park, Jinsol; Ji, Dong Jin; Cho, Dong-Ho, IEEE WIRELESS COMMUNICATIONS LETTERS, v.10, no.6, pp.1173 - 1177, 2021-06 |
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