Browse "School of Electrical Engineering(전기및전자공학부)" by Type Conference
Showing results 6501 to 6520 of 22783
| Derivations of decoder and beamforming vector for amplify-and-forward relays based on the Cauchy-Schwartz inequality Kim, S.; Kim, J.; Choi, W.-C.; Park, Dong-Jo, 2009 9th International Symposium on Communications and Information Technology, ISCIT 2009, pp.518 - 519, IEEE, 2009-09-28 |
| Derivstions of Decoder and Beamforming Vector for Amplify-and-Forward Relays Based on the Cauchy-Schwartz Inequality Park, Dong-Jo; Kim, S; Kim, J; Choi, WC, IEEE International Symposium on Communication and Information Technology, pp.518 - 519, 2009 |
| Desgin of Multiobjective Satisfactory Fuzzy Logic Controller Using Reinforcement Learning Bien, Zeung nam, International Technical Conference on Circuits/Systems, Computers and Communications, 2000 |
| Design of efficient organic pulse oximetry sensors Lee, Hyeon Woo; Kim, Eunhye; Kim, Min-Cheol; Yoo, Seunghyup, The 10th Asian Conference on Organic Electronics, City University of Hong Kong, Hong Kong, 2018-12-07 |
| Design & Simulation of Dual-mode VCOs for PCS/IMT-2000 Applications Yoon, Giwan, 3rd Topical Symposium on Millimeter Waves, pp.171 - 174, 2001-03 |
| Design and Analysis of a 10 Gbps USB 3.2 Gen 2 Type-C Connector for TV Set-Top Box Son, Kyungjune; Choi, Sumin; Jung, Daniel Hyunsuk; Kim, Keunwoo; Park, Gapyeol; Lho, Daehwan; Park, Hyunwook; et al, 28th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-10 |
| Design and analysis of an active simultaneously switching output noise reduction scheme Park, Shinyoung; Kim, Subin; Shin, Taein; Kim, Joungho, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.222 - 225, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of Chip-level Wireless Power Transfer Using Magnetic-field Resonance Coupling and 0.18 um CMOS Technology Kim, Joungho; Song, Jinwook; Jeong, Seungtaek; Park, Shinyoung, Asia-Pacific International Symposium on Electromagnetic Compatibility, Asia-Pacific International Symposium on Electromagnetic Compatibility, 2017-06-22 |
| Design and Analysis of Double-Eight Shaped Shielding Coil for Solenoid Coil in Loosely-Coupled Wireless Power Transfer System Sim, BooGyo; Jeong, Seung Taek; Lee, Seongsoo; Hong, Seokwoo; Kim, Hongseok; Kim, Joungho, 2019 IEEE International Symposium on Electromagnetic Compatibility, Signal and Power Integrity, EMC+SIPI 2019, pp.639 - 643, Institute of Electrical and Electronics Engineers Inc., 2019-07 |
| Design and Analysis of EMI Shielding Method using Intermediate Coil for Train WPT System Lee, Seongsoo; Jeong, Seungtaek; Hong, Seokwoo; Sim, Boogyo; Kim, Joungho, IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), IEEE MTT-S Wireless Power Transfer Conference(WPTC 2018), 2018-06-05 |
| Design and analysis of flexible interconnects on an extremely thin silicon substate for flexible wearable devices Jeong, Seung Taek; Kim, Subin; Kim, Youngwoo; Park, Shinyoung; Park, Hyunwook; Kim, Joungho; Lee, Jae Hak; et al, 2019 Joint International Symposium on Electromagnetic Compatibility, Sapporo and Asia-Pacific International Symposium on Electromagnetic Compatibility, EMC Sapporo/APEMC 2019, pp.387 - 390, Institute of Electrical and Electronics Engineers Inc., 2019-06 |
| Design and Analysis of HDMI 2.1 Connector for Crosstalk Reduction using Tabs and Inverse Tabs Lho, Daehwan; Kim, Joungho; Park, Hyunwook; Park, Gap Yeol; Park, Joonsang; Son, Kyungjune; Sim, BooGyo; et al, 30th IEEE Conference on Electrical Performance of Electronic Packaging and Systems, EPEPS 2021, IEEE, 2021-10-17 |
| Design and Analysis of Hierarchical Power Distribution Network (PDN) for Full Wafer Scale Chip (FWSC) Module Kim, Hyunwoo; Park, Joonsang; Son, Keeyoung; Kim, Joungho; Kim, Haeyeon; Park, Hyunwook; Shin, TaeIn; et al, IEEE Electrical Design of Advanced Packaging and Systems, EDAPS 2022, IEEE, 2022-12-13 |
| Design and analysis of high bandwidth memory (HBM) interposer Considering Signal and Power integirty (SI/PI) for terabyte/s bandwidth system Kim, Joungho; Cho, Kyungjun; Lee, Hyunsuk; Kim, Heegon; Kim, Youngwoo; Choi, Sumin; Kim, Subin; et al, DesignCon 2017, DesignCon 2017, 2017-02-01 |
| Design and analysis of high-definition multimedia interface connectors considering signal integrity Kumar, Gaurav; Park, Gapyeol; Park, Hyunwook; Lho, Daehwan; Park, Junyong; Kim, Joungho; Lee, Junho; et al, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Design and Analysis of Hybrid Loop-array for High Efficiency and Low EMF Level in Wireless High Power Transfer System Kim, Joungho; Lee, Seongsoo; Cho, Yeonje; Kim, Hongseok; Song, Chiuk; Jeong, Seungtaek, IEEE Wireless Power Transfer Conference 2017, IEEE Wireless Power Transfer Conference 2017, 2017-05-10 |
| Design and analysis of improved multi-module memory bus using Wilkinson power divider Kim, J.; Song, E.; Kim, J.; Kim, Joungho; Sung, M.; Kim, J.; So, B., IEEE International Symposium on Electromagnetic Compatibility, EMC 2006, pp.642 - 645, IEEE, 2006-08-14 |
| Design and Analysis of Interposer-level Integrated Voltage Regulator for Power Noise Suppression in High Bandwidth Memory I/O Interface Kim, Subin; Kim, Youngwoo; Cho, Kyungjun; Song, Jinwook; Park, Shinyoung; Park, Junyong; Park, Hyunwook; et al, 27th IEEE Conference on Electrical Performance on Electronic Packaging and Systems (EPEPS), pp.159 - 161, IEEE, 2018-10-15 |
| Design and Analysis of LTE MIMO Handset Antenna with Enhanced Isolation using Decoupling Technique Park, SeongOok, 2009 International Symposium on Antennas and Propagation, 2009-10-20 |
| Design and Analysis of Magnetically Coupled Coil Structures for PCB-to-Active Interposer Wireless Power Transfer in 2.5D/3D-IC Kim, Joungho, IEEE Electrical Design of Advanced Packaging & System Symposium, IEEE Electrical Design of Advanced Packaging & System Symposium, 2014-12-15 |
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