Browse "School of Electrical Engineering(전기및전자공학부)" by Title
Showing results 27581 to 27600 of 51608
| Noise bandwidth suppression for low noise readout circuit Kim, B; Lee, Hee Chul, ELECTRONICS LETTERS, v.38, no.12, pp.558 - 560, 2002-06 |
| Noise cancelling with autoassociative memory trained by order statistics Bae, J; Ryu, Y; Song, Iickho, Proceedings of the 1994 IEEE International Conference on Neural Networks. Part 1 (of 7), v.5, pp.3431 - 3436, 1994-06-27 |
| Noise Capacitive Sensor for Multi-Touch Mobile Handset's Applications Ko, S.; Shin, H.; Lee, J.; Jang, H.; So, B.-C.; Yun, I.; Lee, Kwyro, IEEE ASIAN SOLID-STATE CIRCUITS CONF., pp.113 - 116, IEEE, 2009-12 |
| Noise Characteristics of a Wavelength-Locked Fabry-Perot Laser Diode Park, Kun-Youl; Lee, Chang-Hee, IEEE JOURNAL OF QUANTUM ELECTRONICS, v.44, no.11-12, pp.995 - 1002, 2008 |
| Noise coupling analysis and reduction in 3D-IC considering through-silicon via (TSV) nonlinearity = 3차원 집적회로에서 TSV의 비선형성을 고려한 노이즈 커플링 분석 및 감소에 관한 연구link Cho, Jong-Hyun; 조종현; et al, 한국과학기술원, 2013 |
| Noise Coupling Analysis between TSV and Active Circuit Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Noise coupling analysis of power distribution network and signal traces in high-speed system on package (SoP) = 고속 패키지 내 시스템 (SoP) 에서 전력 분배 연결망과 신호선 사이의 노이즈 간섭 분석link Kim, Jin-Gook; 김진국; et al, 한국과학기술원, 2006 |
| Noise Coupling Effects on CMOS Analog-to-Digital Converter in Magnetic Field Wireless Power Transfer System Using Chip-PCB Comodeling and Simulation Kim, Joung-Ho; Bae, Bumhee; Kim, Jonghoon; Kim, Suk Jin; Kong, Sunkyu, IEEE TRANSACTIONS ON ELECTROMAGNETIC COMPATIBILITY, v.57, no.3, pp.329 - 338, 2015-06 |
| Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
| Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19 |
| Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09 |
| NOISE DISTRIBUTION CHANGE BY GAIN-SATURATED SEMICONDUCTOR OPTICAL AMPLIFIER Moon, Sang-Rok; Yoo, Sang-Hwa; Kye, Myeong-Gyun; Lee, Chang-Hee, OptoElectronics and Optical Communications Conference (OECC), pp.748 - 749, OECC, 2014-07-06 |
| Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12 |
| Noise generation, coupling, isolation, and EM raidaiton in high-speed package and PCB Kim, Joungho; Pak, J.; Park, J.; Kim, H., IEEE International Symposium on Circuits and Systems 2005, ISCAS 2005, pp.5766 - 5769, IEEE, 2005-05-23 |
| NOISE IN A THIN METALLIC MEDIUM - THE CONNECTION WITH NONLINEAR BEHAVIOR MELAS, M; ARNETT, P; Moon, Jaekyun, IEEE TRANSACTIONS ON MAGNETICS, v.24, no.6, pp.2712 - 2714, 1988-11 |
| Noise isolation design, analysis, and verification of T-DMB stacked SiP = T-DMB 적층형 시스템-인-패키지에서의 잡음격리설계와 분석 및 검증link Ha, Myung-Hyun; 하명현; et al, 한국과학기술원, 2007 |
| Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
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