Noise Coupling of Through-Via in Silicon and Glass Interposer
- Publisher
- ECTC2013
- Issue Date
- 2013-05-19
- Language
- English
- Citation
63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810
- Appears in Collection
- EE-Conference Papers(학술회의논문)
- Files in This Item
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