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College of Engineering(공과대학)School of Electrical Engineering(전기및전자공학부)EE-Conference Papers(학술회의논문)

Noise Coupling of Through-Via in Silicon and Glass Interposer

Cited 6 time in webofscience Cited 7 time in scopus
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dc.contributor.authorKim, Jounghoko
dc.contributor.authorJonghyun Choko
dc.contributor.authorJoohee Kimko
dc.contributor.authorJiseoung Kimko
dc.date.accessioned2019-04-15T21:30:32Z-
dc.date.available2019-04-15T21:30:32Z-
dc.date.created2013-06-26-
dc.date.created2013-06-26-
dc.date.created2013-06-26-
dc.date.issued2013-05-19-
dc.identifier.citation63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810-
dc.identifier.urihttp://hdl.handle.net/10203/258445-
dc.languageEnglish-
dc.publisherECTC2013-
dc.titleNoise Coupling of Through-Via in Silicon and Glass Interposer-
dc.typeConference-
dc.identifier.wosid000332764900279-
dc.identifier.scopusid2-s2.0-84883437643-
dc.type.rimsCONF-
dc.citation.beginningpage1806-
dc.citation.endingpage1810-
dc.citation.publicationname63rd Electronic Components and Technology Conference (ECTC)-
dc.identifier.conferencecountryUS-
dc.identifier.doi10.1109/ECTC.2013.6575821-
dc.embargo.liftdate9999-12-31-
dc.embargo.terms9999-12-31-
dc.contributor.localauthorKim, Joungho-
dc.contributor.nonIdAuthorJonghyun Cho-
dc.contributor.nonIdAuthorJoohee Kim-
dc.contributor.nonIdAuthorJiseoung Kim-
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EE-Conference Papers(학술회의논문)
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