솔더 조인트 형상 컨트롤에 의한 솔더 이방성 전도 필름의 신뢰성 향Reliability Improvement of Solder Anisotropic Conductive Film (ACF) Joint by Morphology Control of Solder Joints
- Publisher
- (사)한국마이크로전자 및 패키징학회
- Issue Date
- 2015-04-02
- Language
- Korean
- Citation
(사)한국마이크로전자 및 패키징학회(KMEPS) 2015년도 춘계학술대회, pp.5 - 5
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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