| 5941 | The effect of bonding conditions on the electrical properties of solder joints fabricated by mechanical caulking using reflowed Sn bumps Yang, JH; Kim, YH; Moon, JS; Lee, Won-Jong, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| 5942 | The effect of bottom electrode on the ferroelectric property of RF-magnetron sputtered BaTiO3 thin films Choi, Si-Kyung; Cho, YW, CIMTEC 2002, pp.953 - 960, 2002 |
| 5943 | The Effect of Buffer Layer on the Fabrication and Characteristics of Ferroelectric Thin Films No, Kwangsoo; Song, Han Wook; Lee, Joon Sung; Kim, Dae-Won; Kim, Kwang Ho; Sung, Hae-Hyun, MRS Fall Meeting, pp.471 - 476, MRS, 1997-01-01 |
| 5944 | The effect of casting method and heat treating condition on cold workability of high-Si steel 이진형, 대한금속재료학회, 2000 |
| 5945 | The effect of casting methods and heat treating conditions on segregation and formation of ordered phase 이진형, 대한금속재료학회, 2001 |
| 5946 | The effect of Cd and Sn on the fluidity and casting properties in high strength Al-Cu alloy 이진형, 대한금속재료학회, 2000 |
| 5947 | The effect of Cd-substitution site on sinterring behavior and electical properties in PB(Ni1/3Nb2/3)O3-PbTiO3 ceramics Kim, Ho Gi, ISOE '96, 1996-01-01 |
| 5948 | The Effect of Cell Spacings on Intercellular Segregation considering the Diffusion in Solid and Liquid Phase Zin-Hyoung Lee, The 5th Pacific Rim International Conference on Modeling of Casting and Solidification Processes, pp.20 - 23, 2002 |
| 5949 | The Effect of Coherency Strain on Alloy Formation: Migration of Liquid Films : in Diffusion in Solids : Recent Developments, ed. by M.A. Dayanada and G.E. Murch Yoon, Duk Yong, The Metall. Soc. AIME, pp.275 - 292, 1985 |
| 5950 | The effect of cooling rate on the electrical properties of Pb(Zr,Ti)O3 thin films 노광수, 한국요업학회 추계학술발표대회, 한국세라믹학회, 2000-01-01 |
| 5951 | The Effect of Creep Cavitation on the Fatigue Life under Creep-Fatigue Interaction Nam, Soo Woo, 11th Int'l Conf. on Struc Mech. in Reactor Technology, 1991 |
| 5952 | The effect of crystal structure on the PL intensity of Eu doped metal orthovanadates Jeon, Duk Young, The 10th International Display Workshop, pp.1157 - 1160, 2003-01-01 |
| 5953 | The Effect of Cu Addition to Sn-3.5Ag Solder Joint Lee, Hyuck Mo; Choi, WK; Jeong, SW, The 4th Pacific Rim International Conference on Advanced Materials and Processing, pp.1031 - 1034, 2001-12-11 |
| 5954 | The Effect of Cu leadframe oxidation on Cu/EMC adhesion Paik, Kyung-Wook, The 3rd VLSI Packaging Workshop of Japan, pp.57 - 58, 1996-12-01 |
| 5955 | The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion Paik, Kyung-Wook, 2nd Pan Pacific Microelectronics Symposium, pp.233 - 239, 1997-02-01 |
| 5956 | The Effect of d-ferrite on Low Cycle Fatigue and Creep-Fatigue Behaviors at High Temperature in 304L Stainless Steel 남수우, 철강기술 심포지엄, pp.71 - 88, 1999 |
| 5957 | The Effect of delta-ferrite on Low Cycle Fatigue Behavior at High Temerature in Type 304L Strainless Steel Nam, Soo Woo, International Conference on Low Cycle Fatigue and Elasto-Plastic Behavior of Materials, pp.303 - 308, 1998 |
| 5958 | The Effect of Dynamic Strain Ageing during Hold Time on Fatigue Behavior Nam, Soo Woo, The 2nd Int'l Conf, on Fatigue and Fatigue Thresholds, held at the Univ. of Birmingham U.K, 1984 |
| 5959 | The Effect of Electrolyte Temperature on the Passivity of Solid Electrolyte Interphase Formed on Graphite Electrode Pyun, Su Il, International Meeting on Lithium Batteries, 2000 |
| 5960 | The effect of electrolytes on the discharge properties of sulfur electrode for Li/S cells Ryu, HS; Ahn, HJ; Kim, KW; Ahn, JH; Cho, KK; Nam, TH; Lee, Jeong Yong, 2004 Joint International Meeting - 206th Meeting of the Electrochemical Society/2004 Fall Meeting of the Electrochemical Society of Japan,, pp.336 -, 2004-10-03 |
