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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The Effect of Cu leadframe oxidation on Cu/EMC adhesion

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Paik, Kyung-Wookresearcher
Issue Date
1996-12-01
Language
ENG
Citation

The 3rd VLSI Packaging Workshop of Japan, pp.57 - 58

URI
http://hdl.handle.net/10203/118274
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MS-Conference Papers(학술회의논문)
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