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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

The Effect of Cu-base Leadframe Oxidation on the Cu/EMC Adhesion

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Paik, Kyung-Wookresearcher
Issue Date
1997-02-01
Language
ENG
Citation

2nd Pan Pacific Microelectronics Symposium, pp.233 - 239

URI
http://hdl.handle.net/10203/117820
Appears in Collection
MS-Conference Papers(학술회의논문)
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