Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference
Showing results 2361 to 2380 of 7308
| Epoxy/BaTio3 (SrTiO3) Composite Films and Pastes for Organic Substrates Applications Paik, Kyung-Wook, UKC 2006 (US-Korea Conference on Science, Technology, and Entrepreneurship), pp.0 - 0, 2006-08-01 |
| Epoxy/BaTiO3 (SrTiO3) composite films for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Paik, Kyung-Wook; Cho, SD; Hyun, JG; Lee, S; Kim, H; Kim, J, 2005 10th International Symposium on Advanced Packaging Materials: Processes, Properties and Interfaces, v.2005, pp.227 - 232, 2005-03-16 |
| Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic Substrate Applications Cho, S; Hyun, JG; Paik, Kyung-Wook, 2003 International Electronic Packaging Technical Conference and Exhibition, v.2, pp.719 - 725, 2003-07-06 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates Hyun, JG; Jang, KW; Cho, SD; Paik, Kyung-Wook; Kim, HS; Kim, JH, 4th IEEE International Conference on Polymers and Adhesives in Microelectronics and Photonics, pp.105 - 111, 2004-09-12 |
| Epoxy/BaTiO3 composite films and pastes for high dielectric constant and low tolerance embedded capacitors fabrication in organic substrates, 백경욱; 현진걸; 장경운, 한국 마이크로 전자 및 패키징 학회 2004년도 추계기술 심포지움, pp.9 - 10, 한국 마이크로 전자 및 패키징 학회, 2004-11-01 |
| Equal channel angular pressing of carbon nanotube reinforced metal matrix nanocomposites Quang, P; Jeong, YG; Hong, Soon-Hyung; Kim, HS, ACCM-5, v.326-328 I, pp.325 - 328, Asian-Australasian Conference on Composite Materials, 2006-11 |
| Equilibrium Domain Structures in Epitaxial Lead Titanate Films Fabricated by Hydrothermal Epitaxy Below Curie Temperature 최시경; 정원웅; 김창수, 한국세라믹학회, 2005 |
| Equivalent circuit analysis for LiTiO3 and Transition Temperature Ho-Gi Kim, 한국요업학회, 1996-01-01 |
| Equuivalent Circuit Analysis for LiTiO3 ant Transition Temperature 김호기, 한국요업학회 가을, 1996 |
| ESPI를 이용한 플립칩 패키지의 열적 전단변형률 평가 장우순; 이백우; 김동원; 나재웅; 백경욱; 권동일, 대한용접학회 2001년도 추계학술대회, pp.0 - 0, 대한용접학회, 2001-10-25 |
| ESPI와 유한요소해석을 이용한 플립칩 솔더볼의 유동특성 평가 이백우; 정증현; 김주영; 나재웅; 백경욱; 권동일, 대한용접학회 2002년도 춘계학술발표대회, pp.278 - 281, 대한용접학회, 2002-05 |
| Establishment of SCC criteria of stainless steels for hot water storage tank applications based on repassivation kinetics Kwon, Hyuk Sang, 한국부식방식학회 춘계학술발표대회, pp.30 - 30, 한국부식방식학회, 2006-05-01 |
| Estimation of the interfacial fracture energy of metal/polymer system in microelectronic packaging Song, JY; Yu, Jin, 2001 MRS Spring Meeting, v.682, pp.150 - 155, 2001-04-16 |
| Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging Yu, Jin; Son, JY, MRS Proc., pp.N6.2.1 -, 2001 |
| Etch mask재료로서의 알루미늄 산화막의 제조 및 에칭특성(초록 No;B-22) 이원종; 김재환, 한국재료학회 춘계학술연구발표회, 1992 |
| Etching Dynamics of Geometrically Confined Silicon Nanostructure Koo, Kunmo; Yuk, Jong Min; Chang, Joon Ha; Ji, Sanghyeon; Choi, Jacob; Shin, Sengmin; Lee, Geun-Taek; et al, 2022 Microscopy and Microanalysis, Microscopy Society of America, 2022-08-02 |
| Etching properties of aluminum oxide films prepared by plasma enhanced metal organic chemical vapor deposition : High Performance Ceramic Films and Coatings Lee, Won-Jong; Park, Chong-Ook; Chun, Soung Soon; Kang, CJ; Kim, YC, 7th CIMTEC--World Ceramics Congress, pp.391 - 398, CIMTEC--World Ceramics Congress, 1990-06 |
| Eu-doped SnO2 as a transparent conductive phosphor layer for CNT emitters Ahn, Byung Tae, International Symposium on Nanomanufacturing, pp.0 - 0, 2004-11-01 |
| Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 |
| Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, 12th Interntional Symposium on Integrated Ferroelectrics, v.35, no.40547, 2000-03-12 |
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