Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Jeon, Young-Doo
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| Comparison of Ni-filled Balls and Au-coated Polymer Balls in High-frequency Application of ACF flip-chip Joint Paik, Kyung-Wook; Ahn, Seung Young; Rhu, Woong Hwan; Yim, Myung-Jin; Lee, Jun Ho; Jeon, Young-Doo; Kim, Woo Poung; et al, APACK'99 Symposium on Advances in Packaging, pp.353 - 356, 1999-12-01 |
| Microwave frequency model of flip-chip interconnects using anisotropic conductive film Ryu, Woong Hwan; Yim, Myung-Jin; Lee, Junho; Jeon, Young-Doo; Ahn, Seung Young; Yun, Young-Hwan; Ham, Seog-Heon; et al, Proceedings of the 1999 International Conference on High Density Packaging and MCMs, pp.311 - 315, SPIE, 1999-04-06 |
| 무전해 니켈 UBM을 이용한 여러 솔더 범프의 계면 반응 및 신뢰성에 관한 연구 = Studies on interfacial reactions and reliabilities of various solder bumps on electroless Ni-P UBMslink 전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2004 |
| 무전해 니켈 도금법을 이용한 플립칩 접속용 범프 및 하부금속층에 관한 연구 = A study on the Ni flip chip bumps and under bump metallurgy formation using electroless Ni plating methodslink 전영두; Jeon, Young-Doo; et al, 한국과학기술원, 2000 |
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