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(A) study on the effect of Zn on the interfacial reactions and impact reliability of lead-free solder joints = 무연솔더 접합부의 계면 반응과 충격 신뢰성에 Zn가 미치는 영향link Jee, Young-Kun; 지영근; et al, 한국과학기술원, 2010 |
Effects of Zn Addition on the Interface Microstructure and Drop Reliability of Sn-3.5Ag Solder on Cu pads Jee, Young-Kun; Ko, Yong-Ho; Sohn, Yoon-Chul; Yu, Jin, ELECTRONIC MATERIALS LETTERS, v.2, no.3, pp.161 - 166, 2006-12 |
무연솔더와 PCB 표면금속층과의 젖음성 및 신뢰성에 관한 연구 = A comparative study of the effect of PCB surface finish on the mechanical reliability of solder joints in micro electronic packaginglink 지영근; Jee, Young-Kun; et al, 한국과학기술원, 2006 |
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