학위논문(석사) - 한국과학기술원 : 신소재공학과, 2006.2, [ vii, 69 p. ]
Kirkendall void; PCB표면처리; 무연솔더; 금속간화합물의 취성; IMC brittleness; Kirkendall void; PCB surface; Lead-free solder
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