Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Author Choi, Yongwon
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| 3D-TSV Vertical Interconnection Method using Cu/SnAg Double Bumps and B-stage Non-Conductive Adhesives (NCAs) Choi, Yongwon; Shin, Jiwon; Paik, Kyung-Wook, The 62nd Electronic Components and Technology Conference, ECTC, 2012-05 |
| 3D-TSV Vertical Interconnection Using Cu/SnAg Double Bumps and Non-Conductive Films (NCFs) Paik, Kyung-Wook; Choi, Yongwon; Shin, Jiwon, 2013 Pan Pacific Microelectronics Symposium, 2013 Pan Pacific Microelectronics Symposium, 2013-01-23 |
| Effect of Flux Activators on the Solder Wettability of Solder Anisotropic Conductive Films Kim, Seung-Ho; Choi, Yongwon; Kim, Yoo Sun; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.5, no.1, pp.3 - 8, 2015-01 |
| Fine pitch chip on board (CoB) bonding using B-stage non-conductive film (NCF) for 3D TSV vertical interconnection Choi, Yongwon; Shin, Ji-Won; Kim, Il; Kim, Young-soon; Paik, Kyung-Wook, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013) , pp.186 - 191, 15th IEEE International Symposium and Exhibition on Advanced Packaging Materials (APM 2013), 2013-02-27 |
| Flux Function added Solder Anisotropic Conductive Films (ACFs) for High Power and Fine Pitch Assemblies Kim, Seung-Ho; Choi, Yongwon; Kim, Yoosun; Paik, Kyung-Wook, The 63rd Electronic Components and Technology Conference, pp.1713 - 1716, The 63rd Electronic Components and Technology Conference, 2013-05-29 |
| Synthesis of colloidal VO2 nanoparticles for thermochromic applications Choi, Yongwon; Sim, Dong Min; Hur, Yoon Hyung; Han, Hyeuk Jin; Jung, Yeon Sik, SOLAR ENERGY MATERIALS AND SOLAR CELLS, v.176, pp.266 - 272, 2018-03 |
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