Browse "Dept. of Materials Science and Engineering(신소재공학과)" by Type Conference

Showing results 6221 to 6240 of 7308

6221
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, KW; Kim, JS; Oh, SH; Seo, HS, 제5회 한국반도체 학술대회, pp.587 - 588, 한국반도체 학술대회, 1998-02-01

6222
Thermo-Mechanical Stresses in Laminated Polymer Films on Silicon Substrates

Paik, Kyung-Wook; Kim, JS; Oh, SH; Seo, HS, International Conference and Exhibition on Multichip Modules and High Density Packaging, pp.449 - 453, International Conference and Exhibition on Multichip Modules and High Density Packaging, 1998-04-01

6223
Thermo-Mechanical Stresses in Lamination Based Si Monolithic MCM-D Substrates

Paik, Kyung-Wook, Materials Research Society Spring Meeting, pp.192 - 192, 1998-05-01

6224
Thermo-Optic Characteristics and Applications of the Sol-Gel Hybrid Material Films

Bae, Byeong-Soo, The 5th International Meeting of Pacific Rim Ceramic Societies, 2003

6225
Thermo-Wetting Embossing Nano Imprinting (TENI) Process of HYBRIMERs for Sub-Micron Scale Structure Fabrication

Bae, Byeong-Soo; W.S. Kim; K.H. Nam; K.B. Yoon, ISNM 2004, 2004

6226
Thermoacoustic Loudspeaker Using N-doped Reduced Graphene Oxide Aerogel

김충선; 이경은; 김상욱; 최정우; 조병진, The 3rd Korean Graphene Symposium, 한국그래핀연구회, 2016-04-15

6227
Thermochemical Production of Sodium Borohydride from Sodium Metaborate in a Scaled-up Reactor

Cho, Eun-Ae; Eom, K.S.; Kim, M.J.; Oh, S.K.; Nam, SW.; Kwon, HS., International Conference on Hydrogen Production, International Conference on Hydrogen Production, 2012-06-24

6228
Thermochemical stability of IrO2 bottom electrodes in direct liquid injection metalorganic chemical vapor deposition of Pb(Zr,Ti)O3 films

Lee, Won-Jong; Byun, KM; Kim, YH, 8th Conference of the European Ceramic Society, pp.8 - 8, 2003

6229
Thermochemical stability of IrO2 electrodes in direct liquid injection metalorganic chemical vapor deposition of Pb-based ferroelectric films

이원종, 대한금속재료학회 추계학술발표대회, pp.66 - 66, 2002-10-01

6230
Thermodynamic alloy design of lead-free solders and thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck Mo, 58th Congresso Anual da ABM (Associacao Brasileira de Metalurgia e Materiais), pp.842 - 849, 2003-07-21

6231
Thermodynamic Analysis of the Microstructural Change in Sn-rich Solders affected by their Interfacial Reaction with Cu or Ni(P) UBM

Lee, Hyuck Mo, 38th CALPHAD, 2009-05-17

6232
Thermodynamic and Kinetic Approaches to Lithium Intercalation into Sol-gel Derived Li1-dMn2O4 Electrode

변수일, 한국전기화학회 1999년도 제3회 총회 및 추계학술발표회, pp.64 - 64, 1999

6233
Thermodynamic assessment of the Bi-Ni system and Phase Equilibria of the Sn-Bi-Ni System

Lee, Hyuck Mo, 136th TMS Annual Meeting, 2007-02-25

6234
thermodynamic Consideration for Morphotropic Tetragonal and Rhombohedral Phase Boundary in PZT System

김호기, The Korean Ceramic Soc., Processding of the 4th symposium of on Electronic Ceramics, Seoul Univ., 1990

6235
Thermodynamic issues of lead-free soldering in electronic packaging

Jeong, SW; Kim, JH; Lee, Hyuck Mo, Thermec 2003 Processing and Manufacturing of Advanced Materials, no.5, pp.4081 - 4086, 2003-07-07

6236
Thermodynamics of Chemical Vapor Deposition and Its Application to Diamind Deposition

Yoon, Duk Yong, ibid., pp.905 - 912, 1995

6237
Thermodynamics-Aided Alloy Design of Sn-Bi-In-Zn Solder System

Lee, Hyuck Mo; Yoon, SW; Soh, JR, International Conference on Modelling and Simulation in Metallurgical Engineering and Materials Science, pp.160 - 165, 1996

6238
Thermoelectric Properties of PbTe@C Nanocables Prepared via One-Step Hydrothermal Synthesis

Yong, Seok-Min; Kim, Do-Kyung, Asian Thermophysical Properties Conference, 한국열물성학회, 2013-09-29

6239
Thermomechanical stress analysis of Multilayer PCBs consisting of metals and viscoelastic polymers

Paik, Kyung-Wook; Lim, JH; Kim, JS; Earmme, YY, International Conference on Fracture & Strength of Solids 2000, pp.0 - 0, 2000-12-01

6240
Thick Film Technology-the Application in the Microelectronics

김호기, The Korean Ceramic Soc.Spring Meeting,KAIST, 1984

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