Showing results 6081 to 6100 of 19469
Estimations of the Interfacial Fracture Energy of Metal Polymer System in Microelectronic Packaging Yu, Jin; Son, JY, MRS Proc., pp.N6.2.1 -, 2001 |
Etch mask재료로서의 알루미늄 산화막의 제조 및 에칭특성(초록 No;B-22) 이원종; 김재환, 한국재료학회 춘계학술연구발표회, 1992 |
Etch-induced damage in single crystal Si trench etching by planar inductively coupled Cl-2/N-2 and Cl-2/HBr plasmas Lee, JeongYong; Hwang, SW; Yeom, GY; Lee, JW; Lee, JY, THIN SOLID FILMS, v.341, no.1-2, pp.168 - 171, 1999-03 |
Etching Dynamics of Geometrically Confined Silicon Nanostructure Koo, Kunmo; Yuk, Jong Min; Chang, Joon Ha; Ji, Sanghyeon; Choi, Jacob; Shin, Sengmin; Lee, Geun-Taek; et al, 2022 Microscopy and Microanalysis, Microscopy Society of America, 2022-08-02 |
Etching for microstructural observation of cemented submicrometer-sized carbides Jung, SW; Kim, J; Kang, Suk-Joong L, JOURNAL OF THE AMERICAN CERAMIC SOCIETY, v.84, no.4, pp.899 - 901, 2001-04 |
Etching properties of aluminum oxide films prepared by plasma enhanced metal organic chemical vapor deposition : High Performance Ceramic Films and Coatings Lee, Won-Jong; Park, Chong-Ook; Chun, Soung Soon; Kang, CJ; Kim, YC, 7th CIMTEC--World Ceramics Congress, pp.391 - 398, CIMTEC--World Ceramics Congress, 1990-06 |
Ethylenediamine-Enhanced Oxidation Resistivity of a Copper Surface during Water-Based Copper Nanowire Synthesis Koo, Jahyun; Kwon, Soonho; Kim, Na Rae; Shin, Kihyun; Lee, Hyuck Mo, JOURNAL OF PHYSICAL CHEMISTRY C, v.120, no.6, pp.3334 - 3340, 2016-02 |
Etude des Martensites des Binaires Cuivre-Aluminium Kang, Suk-Joong L, MECANIQUE-MATERIASUX-ELETRICITE, v.0, no.385, pp.18 - 24, 1982-12 |
Eu-doped SnO2 as a transparent conductive phosphor layer for CNT emitters Ahn, Byung Tae, International Symposium on Nanomanufacturing, pp.0 - 0, 2004-11-01 |
Europium-activated rare earth fluoride (LnF(3):Eu3+-Ln=La, Gd) nanocrystals prepared by using ionic liquid/NH4F as a fluorine source via hydrothermal synthesis Kasturi, S; Sivakumar, V; Jeon, Duk Young, LUMINESCENCE, v.31, no.5, pp.1138 - 1145, 2016-08 |
Eutectic Pb/Sn Solder Bump and Under Bump Metallurgy(UBM) Interfacial Reaction and Adhesion Paik, Kyung-Wook, 2nd electronic Packaging Technology Conference, pp.69 - 75, 1998-03-01 |
Eutectic Sn/Pb solder bump and under bump metallurgy (UBM) interfacial reaction and adhesion Jang, Se-Young; Paik, Kyung-Wook, SOLDERING & SURFACE MOUNT TECHNOLOGY, v.10, no.3, pp.29 - 37, 1998-03 |
Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, 12th Interntional Symposium on Integrated Ferroelectrics, v.35, no.40547, 2000-03-12 |
Evaluation method of longitudinal and transverse piezoelectric d-coefficients for thin films Kim, DG; Kim, Il-Doo; Lee, CH; Park, JH; Choi, KP; Kim, Ho Gi, INTEGRATED FERROELECTRICS, v.35, no.1-4, pp.2029 - 2042, 2001 |
Evaluation of Ablation Behaviors of HfC-SiC Ultra High Temperature Ceramics (UHTCs) under Oxyacetylene Torch 백창연; 김주형; 성영훈; 김동석; 이제훈; 김도경, 2015 한국세라믹학회 춘계학술대회 및 총회, 한국세라믹학회, 2015-04-17 |
Evaluation of Aluminum Nitride(AlN) Substrate Material for High Density Interconnect(HDI) Applications Paik, Kyung-Wook, Proceedings of the 1992 International Symposium on Hybrid Microelectronics (ISHM) conference, pp.555 - 560, 1992-03-01 |
Evaluation of Analysis Conditions for Laser-Pulsed Atom Probe Tomography: Example of Cemented Tungsten Carbide Peng, Zirong; Choi, Pyuck-Pa; Gault, Baptiste; Raabe, Dierk, MICROSCOPY AND MICROANALYSIS, v.23, no.2, pp.431 - 442, 2017-04 |
Evaluation of anisotropic thermoelectric power of ReSi1.75 Oh, Min-Wook; Gu, Jia-Jun; Inui, Haruyuki; Oh, Myung-Hoon; Wee, Dang-Moon, PHYSICA B-CONDENSED MATTER, v.389, no.2, pp.367 - 371, 2007-02 |
Evaluation of continuous low-cycle fatigue behaviour of high temperature P122 boiler material Pumwa J.; Nam, Soo Woo, 10th International Conference on Nuclear Engineering (ICONE 10), v.1, pp.443 - 452, 2002-04-14 |
Evaluation of corrosion-resistant behavior of Al-1000 series and passivation treatment Sung, Jun Mo; Jung, Ki Min; Kim, Jongsoo; Kwon, Hyuk Sang, 한국부식방식학회 춘계학술대회, 한국부식방식학회, 2016-05-20 |
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