Evaluation of Aluminum Nitride(AlN) Substrate Material for High Density Interconnect(HDI) Applications

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Issue Date
1992-03-01
Language
ENG
Citation

Proceedings of the 1992 International Symposium on Hybrid Microelectronics (ISHM) conference, pp.555 - 560

URI
http://hdl.handle.net/10203/104922
Appears in Collection
MS-Conference Papers(학술회의논문)
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