Evaluation of Aluminum Nitride(AlN) Substrate Material for High Density Interconnect(HDI) Applications
- Issue Date
- 1992-03-01
- Language
- ENG
- Citation
Proceedings of the 1992 International Symposium on Hybrid Microelectronics (ISHM) conference, pp.555 - 560
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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