DSpace at KOASAS: Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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Son H.-Y. / Kim I. / Park J.-H. / Lee S.-B. / Jung G.-J. / Park B.-J. / Paik, Kyung-Wook researcher

Issue Date: 2008-05-27

Language: ENG

Citation: 2008 58th Electronic Components and Technology Conference, ECTC, pp.2035 - 2043

ISSN: 0569-5503

URI: http://hdl.handle.net/10203/157280

Appears in Collection: MS-Conference Papers(학술회의논문)

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Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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