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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Studies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis

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dc.contributor.authorSon H.-Y.-
dc.contributor.authorKim I.-
dc.contributor.authorPark J.-H.-
dc.contributor.authorLee S.-B.-
dc.contributor.authorJung G.-J.-
dc.contributor.authorPark B.-J.-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-26T23:51:22Z-
dc.date.available2013-03-26T23:51:22Z-
dc.date.created2012-02-06-
dc.date.issued2008-05-27-
dc.identifier.citation2008 58th Electronic Components and Technology Conference, ECTC, v., no., pp.2035 - 2043-
dc.identifier.issn0569-5503-
dc.identifier.urihttp://hdl.handle.net/10203/157280-
dc.languageENG-
dc.titleStudies on the thermal cycling reliability of fine pitch Cu/SnAg double-bump flip chip assemblies on organic substrates: Experimental results and numerical analysis-
dc.typeConference-
dc.identifier.scopusid2-s2.0-51349162715-
dc.type.rimsCONF-
dc.citation.beginningpage2035-
dc.citation.endingpage2043-
dc.citation.publicationname2008 58th Electronic Components and Technology Conference, ECTC-
dc.identifier.conferencecountryUnited States-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorSon H.-Y.-
dc.contributor.nonIdAuthorKim I.-
dc.contributor.nonIdAuthorPark J.-H.-
dc.contributor.nonIdAuthorLee S.-B.-
dc.contributor.nonIdAuthorJung G.-J.-
dc.contributor.nonIdAuthorPark B.-J.-
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MS-Conference Papers(학술회의논문)
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