DSpace at KOASAS: Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

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College of Engineering(공과대학)Dept. of Materials Science and Engineering(신소재공학과)MS-Conference Papers(학술회의논문)

Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

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Shin, JW / Song, MS / Park, YS / Kwon, YM / Moon, JT / Cho, JS / Yoo, KA / Byun, KY / Joh, CH / Do, EH / Paik, Kyung-Wook researcher

Issue Date: 2009-12-09

Language: ENG

Citation: 2009 11th Electronic Packaging Technology Conference, EPTC 2009, pp.942 - 946

URI: http://hdl.handle.net/10203/156782

Appears in Collection: MS-Conference Papers(학술회의논문)

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Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

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