Analysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage

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dc.contributor.authorShin, JW-
dc.contributor.authorSong, MS-
dc.contributor.authorPark, YS-
dc.contributor.authorKwon, YM-
dc.contributor.authorMoon, JT-
dc.contributor.authorCho, JS-
dc.contributor.authorYoo, KA-
dc.contributor.authorByun, KY-
dc.contributor.authorJoh, CH-
dc.contributor.authorDo, EH-
dc.contributor.authorPaik, Kyung-Wook-
dc.date.accessioned2013-03-26T01:30:22Z-
dc.date.available2013-03-26T01:30:22Z-
dc.date.created2012-02-06-
dc.date.issued2009-12-09-
dc.identifier.citation2009 11th Electronic Packaging Technology Conference, EPTC 2009, v., no., pp.942 - 946-
dc.identifier.urihttp://hdl.handle.net/10203/156782-
dc.languageENG-
dc.titleAnalysis on interfacial failures of ultra-fine pitch wire with low inter-metallic coverage-
dc.typeConference-
dc.identifier.scopusid2-s2.0-77950942426-
dc.type.rimsCONF-
dc.citation.beginningpage942-
dc.citation.endingpage946-
dc.citation.publicationname2009 11th Electronic Packaging Technology Conference, EPTC 2009-
dc.identifier.conferencecountrySingapore-
dc.identifier.conferencecountrySingapore-
dc.contributor.localauthorPaik, Kyung-Wook-
dc.contributor.nonIdAuthorShin, JW-
dc.contributor.nonIdAuthorSong, MS-
dc.contributor.nonIdAuthorPark, YS-
dc.contributor.nonIdAuthorKwon, YM-
dc.contributor.nonIdAuthorMoon, JT-
dc.contributor.nonIdAuthorCho, JS-
dc.contributor.nonIdAuthorYoo, KA-
dc.contributor.nonIdAuthorByun, KY-
dc.contributor.nonIdAuthorJoh, CH-
dc.contributor.nonIdAuthorDo, EH-
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MS-Conference Papers(학술회의논문)
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