Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems
- Publisher
- IEEE
- Issue Date
- 2000-05-01
- Language
- English
- Citation
50th Electronic Components and Technology Conference, pp.64 - 68
- ISSN
- 0569-5503
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
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