DC Field | Value | Language |
---|---|---|
dc.contributor.author | Jang, Se-Young | ko |
dc.contributor.author | Paik, Kyung-Wook | ko |
dc.date.accessioned | 2007-09-11T05:32:04Z | - |
dc.date.available | 2007-09-11T05:32:04Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2000-05-01 | - |
dc.identifier.citation | 50th Electronic Components and Technology Conference, pp.64 - 68 | - |
dc.identifier.issn | 0569-5503 | - |
dc.identifier.uri | http://hdl.handle.net/10203/1398 | - |
dc.language | English | - |
dc.language.iso | en_US | en |
dc.publisher | IEEE | - |
dc.title | Comparison of electroplated eutectic Sn/Bi and Pb/Sn solder bumps on various UBM systems | - |
dc.type | Conference | - |
dc.identifier.wosid | 000088390200012 | - |
dc.identifier.scopusid | 2-s2.0-0034476624 | - |
dc.type.rims | CONF | - |
dc.citation.beginningpage | 64 | - |
dc.citation.endingpage | 68 | - |
dc.citation.publicationname | 50th Electronic Components and Technology Conference | - |
dc.identifier.conferencecountry | US | - |
dc.identifier.conferencelocation | Las Vegas, NV | - |
dc.embargo.liftdate | 9999-12-31 | - |
dc.embargo.terms | 9999-12-31 | - |
dc.contributor.localauthor | Paik, Kyung-Wook | - |
dc.contributor.nonIdAuthor | Jang, Se-Young | - |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.