Browse "Dept. of Mechanical Engineering(기계공학과)" by Author 668
Showing results 49 to 108 of 177
| Definition of damage parameter in low-cycle fatigue of gray cast iron Lee, KO; Lee, Soon-Bok, Key Engineering Materials, v.345-346, pp.367 - 370, Trans Tech Publications Ltd., 2007-08 |
| Determination of Material Constants of Creep Constitutive Equation Lee, Soon-Bok; Kim, Jin-Young; Huh, Yong-Hak, KSME Spring Conference, KSME 99S126, pp.783 - 787, 1999 |
| Development of a Creep-fatigue life prediction model for type 316L stainless steels Lee, Jun Youn; Lee, Soon-Bok, ATEM'03, pp.GSW - 309, 2003 |
| Development of a structural fatigue testing machine and its application Lee, Soon-Bok, Proc. of the first Asian-Pacific Colloquium on strength Evaluation(A.P.C.S), pp.51 - 60, 1984 |
| Development of Viscoplastic Finite Element Analysis Program using Arbitrary State Variables Kim, JY; Lee, Soon-Bok; Huh, YH, KSME1999 Fall Conference, KSME 99F051, pp.296 - 301, 1999 |
| Die Shear test of the coined solder bumps package with various UBM and solder materials Lee, Soon-Bok; Hwang, TK; Nah, JW; Paik, KW, , 2003 |
| Dynamic Strain Agging under Tensile and LCF Loading Conditions in some Alloys Lee, KO; Lee, Soon-Bok; Hong, SHong G, International Fatigue Congress, 2006 |
| Dynamic strain aging and pre-straining effects on the fatigue resistance of type 316L stainless steel Lee, Soon-Bok; Hong, Seong-Gu; Lee, KO, Int. Conference on Fatigue Damage of Structural Materials, 2004 |
| Dynamic Strain Aging Effect on the Cyclic Stress Response and Fatigue Resistance of Type 316 Stainless Steel Lee, Soon-Bok; Hong, Seong-Gu, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Dynamic Strain Aging under Tensile Loading Conditions in Some High-Temperature Alloys Lee, Soon-Bok; Lee, Keum-Oh, 2006 KSME Spring Conference, 2006 |
| Effect of a brazing process on mechanical and fatigue behavior of alclad aluminum 3005 Kim, Hyun-Ho; Lee, Soon-Bok, ICMR2011, 2011-11 |
| Effect of high glass transition temperature on reliability of Non-Conductive Film (NCF) Park, JH; Chung, CK; Paik, KW; Lee, Soon-Bok, International Confernce on Experimental Mechanics, 2006, v.326-328 I, pp.517 - 520, 2006 |
| Effect of Thermal Conductivity on its Thermal Fatigue Behavior of Solder Joints under Power Cycling Condition Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, 2004 KSME conference of Materials and Fracture Division KSME04MF30, pp.176 - 184, 2004 |
| Effect of thickness on mechanical properties and behavior of submicron copper film on polymer substrate Lee, Soon-Bok; Kim, Sung Yeol; Baek, Dong-Cheon, 2005 KSME Spring Conference, 05S014, pp.9 - 9, 2005 |
| Effects of cooling rates on material behaviors of solder alloys Lee, Soon-Bok; Hwang, Tae-Kyung, IMAPS-Korea 추계 기술 심포지움, pp.24 - 24, 2004 |
| Effects of Silica Filler Size and Contents in Non-Conductive Film (NCF) on Micro-bump Interconnection and Chip-On-Board (COB) reliability Lee, Soon-Bok; Bae, J.S.; Shin, J.W.; Paik, K.W., International Conference on Experimental Mechanics 2014, International Conference on Experimental Mechanics 2014, 2014-11-17 |
| Evaluation of Crack Initiation Life in notched Pipe Submitted to Cyclic Bending Load Park, YW; Kang, KJ; Kim, YJ; Yoo, B; Lee, Soon-Bok, KSME 2000 conference of Materials and Fracture Division, pp.72 - 79, 2000-02 |
| Evaluation of Notch Tip Strains using Whole Field Optical Measurement Technigues Yang, Se Young; Lim, Jae-Yong; Lee, Soon-Bok, ATEM'03, pp.OS01W - 308, 2003-09 |
| Evaluation of thermal deformation behavior in electronic package using UV moire interferometry Paik, JH; Lee, Soon-Bok, 2005 International Symposium on Electronics Materials and Packaging, EMAP 2005, v.2005, pp.209 - 214, 2005-12-11 |
| Experimental Approaches for Solder Joint Relaibility Lee, Soon-Bok; Ham, SJ; Park, TS, SEMICON Korea Technical Sysmposium 2002, pp.79 - 85, 2002-01-01 |
| Experimental Study for Solder Joint Reliability of Surface-Mounted Assembly Subjected to Mechanical Overload Ham, SJ; Lee, Soon-Bok, ASME Interpack, Advances in Electronic Packaging, pp.1593 - 1598, 1997 |
| Experimental Techniques for Fatigue Reliability of BGA Solder Bumps in Electronic Packaging Lee, Soon-Bok; Park, TS; Ham, SJ, International Conference on Advanced Technology in Experimental Mechanics, ATEM'99, pp.661 - 666, 1999 |
| Fatigue and failure prevention in machine design Lee, Soon-Bok, Proc. of Korea-U.S.A. Design Engineering Conference, pp.361 - 379, 1988 |
| Fatigue and Fracture Assessment for Reliability of Electronics Packaging Lee, Soon-Bok; Kim, Ilho, International Conference of Fracture, 2011-08-04 |
| Fatigue Behavior of Electrodeposited Nanocrystalline Nickel Films Lee, Soon-Bok; Baek, Dong-cheon, International Conf on Mechanical Behavior of Materials, ICM11, 2011-06 |
| Fatigue crack growth behavior of Mod.9Cr-1Mo steel at elevated temperatures: Effect of temperature, loading frequency and R ratio Lee, Jeong Hwan; Lee, Hyeong Yeon; Hong, Seong Gu; Lee, Soon Bok, Asian Conference on Experimental Mechanics(ACEM) 2016, KSME Materials and Fracture Division / Reliability Division, 2016-11-16 |
| Fatigue Crack Growth of Creep Damaged Specimens of Type 304 Stainless Steel Lee, Soon-Bok; Park, BS; Kim, JY, Int. Congress on Experimental Mechanics, pp.361 - 362, 1996 |
| Fatigue life assessment of bump type solder joint under vibration environment Lee, Soon-Bok; Ham, SJ, InterPACK '99: Pacific RIM/ASME International Intersociety Electronics Photonic Packaging Conference 'Advances in Electronic Packaging 1999', v.26, pp.699 - 704, 1999-06-13 |
| Fatigue Strength Evaluation of Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints under Mixed Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, KSME 2002 Conferece of Materials and Fracture Division, KSME 02MF026, pp.164 - 170, 2002 |
| Finite Element Analysis and X-ray Measurement of Residual Stresses of Ceramic/Metal Joints Lee, Soon-Bok; Kim, JH, Int. conf. on Mechanics and Materials Engineering (MSME-95), pp.498 - 503, 1995 |
| Flexing Effects on the Accelerated Life Testing of Hydraulic Hose 백동춘; 이순복; 강보식; 김형의, KSME Reliability Division Conference, 2008 |
| Flow Stress Derivation in Dynamic Strain Aging Region Lee, Keum-Oh; Hong, Seong-Gu; Lee, Soon-Bok, International Conference on Fatigue Damage of Structural Materials, 2006 |
| Fracture strength measrement of thin films for low-dimensional structures Lee, Soon-Bok; Back, Dong-Cheon, ICCES 2012, 2012-04-30 |
| Geometrical Effect of Thin Wall Pipe on Deformation Behavior and Low Cycle Faigue life of 429EM Stainless Steel Lee, Soon-Bok; Yoon, Samson; Hong, Seonggu; Lee, Keum-oh, Int. Conference on Fatigue Damage of Structural Materials, 2002 |
| Health monitoring method for electronic package using a simple Moire Interferometry Lee, Soon-Bok; Park, Jin-Hyung, ATEM'07 and ACEM6, 2007 |
| High mean stress effect on the high cycle fatigue behavior of gray cast iron for marine engine applications Lee, Soon-Bok; Hong, SG; An, SC; Park, JS; Kim, BY, Int. Conference on Fatigue Damage of Structural Materials, pp.47 -, 2004 |
| High resolution AFM Moire technique for the detection of defects in nano structure Park, JH; Lee, Soon-Bok, International Conference on Electronic Materials and Packaging 2007, EMAP 2007, 2007-11-19 |
| High temperature life prediction model for ferritic stainless steel using fracture mechanics Lee, Soon-Bok; Lee, Keum-Oh; Bae, KH; Lee, KO; Jin, MC; Park, SJ, Int. Conf. on Structural Engineering, Mechanics and Computation(SEMC), pp.239 - 240, 2007 |
| Highly Conductive Double-layer Graphene under Large Deformation Sejeong Won; Yun Hwangbo; Seung-Mo Lee; Seung-Ki Lee; Jong-Hyun Ahn; Hak-Joo Lee; Jae-Hyun Kim; et al, BIEN2013, BIEN2013, 2013-08-26 |
| Implementation of Thermo-Viscoplastic Constitutive Equations into the Finite Element Code ABAQUS Youn, SS; Lee, Soon-Bok; Kim, JB; Lee, HY; Yoo, B, Structural Mechanics in Reactor Technology, International SMiRT15, 1999 |
| Influence of Pre-straining on low cycle fatigue Behaviorof 316L Stainless steel in Dynamic strain aging regime Lee, Soon-Bok, , 2003 |
| Influence of strain rate on tensile and LCF properties of prior cold worked 316L stainless steel in dynamic strain aging regime Hong, SG; Lee, Soon-Bok, First International Conference on Fatigue Damage of Materials Experiment and Analysis, Fatigue Damage of Materials, pp.137 - 147, 2003-07-14 |
| Isothermal low cycle fatigue tests of Sn/3.5 Ag/0.75 Cu and 63Sn/37Pb solder joints under mixed-mode loading cases Park, TS; Lee, Soon-Bok, 52nd Electronic Components and Technology Conference, pp.979 - 984, 2002-05-28 |
| Low cycle fatigue analysis temperature dffects in Sn/3.5Ag/0.75Cu and 63Sn/37Pb Solder Joints Lee, Soon-Bok; Park, TS, TMA Conference, 2003 |
| Low-cycle fatigue behavior of cyclically non-stabilized 316L stainless steel : Influence of temperature Lee, Soon-Bok; Hong, Seong-Gu, 2004 KSME confernece of Materials and Fractures Division, KSME04MF33, pp.196 - 201, 2004 |
| Low-Cycle Fatigue life prediction using Tomkins Model Lee, Soon-Bok; Lee, Keum-Oh, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Lead-Free Solder Materials Lee, Soon-Bok; Hwang, Tae-Kyung, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Material Characterization of Thin Film in MEMS Structures Lee, Soon-Bok, Micro- Nano (includes Bio-) Technology, UM-KAIST Joint Workshop, pp.1 - 20, 2004 |
| Measurement of Mechanical Properties of Electroplated Nickel Thin Film for MEMS Application Back, DC; Park, TS; Lee, Soon-Bok; Lee, NK; Choi, TH; Na, KH, KSME 2003 Spring Conference, 2003 |
| Measurement of Thermal Deformations of Chip Scale Packages Using Moire Interferometry Ham, SJ; Hwang, TK; Lee, Soon-Bok, SEMICON Korea Technical Symposium 2001, Serial 14, pp.239 - 244, 2001 |
| Measurement of Thermal Deformations of Electronic packages using Moire Interferometry Lee, Soon-Bok; Ham, SJ, KSME 2000 Conference of Materials and Frcture Division, pp.314 - 320, 2000 |
| Measurement of Thermomechanical Behavior of Solder Joint under Power Cycling Condition using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, SEM'04, 2004 |
| Measurement of Thermomechanical Behavior of Solder Joints under Power cycling Condition Using Moire Interferometry Lee, Soon-Bok; Yang, Se Young; Kim, Ilho, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Measurement of Thermomechanical Behaviors of Wafer-Level CSPAssembly under Temperature Cycling Condition Ham, Suk-Jin; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.323 - 327, 2001 |
| Mechanical Behavior of Metallic Submicron Film on Polyimide Substrate:Stress Analysis and Experimental Techniques Lee, Soon-Bok; Baek, Dong Cheon, Tokyo Tech-KAIST joint workshop, pp.58 - 59, 2005 |
| Mechanical behavior of metallic thin film on polyimide substrate Baek, Dong-Cheon; Kim, Sung-Yeol; Lee, Soon-Bok, ECF16, pp.370 -, 2006 |
| Mechanical behavior of submicron metallic thin film on polymer substrate:stress analysis and tensile testing Lee, Soon-Bok; Baek, Dong-Cheon; Kim, Sung-Yeol, 2005 KSME spring conference, 05S016, pp.10 - 10, 2005 |
| Mechanical Fatigue Tests of Solder Joints under Mixed-Mode Loading Cases Park, Tae-Sang; Lee, Soon-Bok, International Symposium on Electronics Materials and Packagings(EMAP2001), pp.438 - 443, 2001 |
| Mechanical Properties of Thin Film for MEMS Application Lee, Soon-Bok; Baek, Dong-Cheon; Park, Tae-Sang, KAIST-Tokyo Tech Joint Workshop, 2004 |
| Mechanical Reliability of Electronics Packaging Lee, Soon-Bok; Ham, SJ, pp.3 - 45, 2001 |
Discover
Open Access
Date issued
- 4,093 2020 - 2024
- 12,322 2010 - 2019
- 10,774 2000 - 2009
- 6,220 1990 - 1999
- 1,879 1980 - 1989