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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Evaluation of thermal deformation behavior in electronic package using UV moire interferometry

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Paik, JH / Lee, Soon-Bokresearcher
Issue Date
2005-12-11
Language
ENG
Citation

2005 International Symposium on Electronics Materials and Packaging, EMAP 2005, v.2005, pp.209 - 214

URI
http://hdl.handle.net/10203/139233
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ME-Conference Papers(학술회의논문)
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