DC Field | Value | Language |
---|---|---|
dc.contributor.author | Paik, JH | - |
dc.contributor.author | Lee, Soon-Bok | - |
dc.date.accessioned | 2013-03-17T03:08:43Z | - |
dc.date.available | 2013-03-17T03:08:43Z | - |
dc.date.created | 2012-02-06 | - |
dc.date.issued | 2005-12-11 | - |
dc.identifier.citation | 2005 International Symposium on Electronics Materials and Packaging, EMAP 2005, v.2005, no., pp.209 - 214 | - |
dc.identifier.uri | http://hdl.handle.net/10203/139233 | - |
dc.language | ENG | - |
dc.title | Evaluation of thermal deformation behavior in electronic package using UV moire interferometry | - |
dc.type | Conference | - |
dc.identifier.scopusid | 2-s2.0-33847329083 | - |
dc.type.rims | CONF | - |
dc.citation.volume | 2005 | - |
dc.citation.beginningpage | 209 | - |
dc.citation.endingpage | 214 | - |
dc.citation.publicationname | 2005 International Symposium on Electronics Materials and Packaging, EMAP 2005 | - |
dc.identifier.conferencecountry | Japan | - |
dc.identifier.conferencecountry | Japan | - |
dc.contributor.localauthor | Lee, Soon-Bok | - |
dc.contributor.nonIdAuthor | Paik, JH | - |
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