DSpace at KOASAS
College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Evaluation of thermal deformation behavior in electronic package using UV moire interferometry

Cited 0 time in webofscience Cited 0 time in scopus
  • Hit : 357
  • Download : 0
Export
DC FieldValueLanguage
dc.contributor.authorPaik, JH-
dc.contributor.authorLee, Soon-Bok-
dc.date.accessioned2013-03-17T03:08:43Z-
dc.date.available2013-03-17T03:08:43Z-
dc.date.created2012-02-06-
dc.date.issued2005-12-11-
dc.identifier.citation2005 International Symposium on Electronics Materials and Packaging, EMAP 2005, v.2005, no., pp.209 - 214-
dc.identifier.urihttp://hdl.handle.net/10203/139233-
dc.languageENG-
dc.titleEvaluation of thermal deformation behavior in electronic package using UV moire interferometry-
dc.typeConference-
dc.identifier.scopusid2-s2.0-33847329083-
dc.type.rimsCONF-
dc.citation.volume2005-
dc.citation.beginningpage209-
dc.citation.endingpage214-
dc.citation.publicationname2005 International Symposium on Electronics Materials and Packaging, EMAP 2005-
dc.identifier.conferencecountryJapan-
dc.identifier.conferencecountryJapan-
dc.contributor.localauthorLee, Soon-Bok-
dc.contributor.nonIdAuthorPaik, JH-
Appears in Collection
ME-Conference Papers(학술회의논문)
Files in This Item
There are no files associated with this item.

Display Simple Item Record

qr_code

  • mendeley

    citeulike

Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.


rss_1.0 rss_2.0 atom_1.0