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College of Engineering(공과대학)School of Mechanical and Aerospace Engineering(기계항공공학부)Dept. of Mechanical Engineering(기계공학과)ME-Conference Papers(학술회의논문)

Fatigue and Fracture Assessment for Reliability of Electronics Packaging

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Lee, Soon-Bokresearcher / Kim, Ilho
Issue Date
2011-08-04
Language
ENG
Citation

International Conference of Fracture

URI
http://hdl.handle.net/10203/24740
Appears in Collection
ME-Conference Papers(학술회의논문)
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