Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability
- Publisher
- 한국 마이크로 전자 및 패키징학회
- Issue Date
- 2000-11-01
- Language
- KOR
- Citation
한국 마이크로 전자 및 패키징학회 추계 기술심포지움, pp.67 - 71
- Appears in Collection
- MS-Conference Papers(학술회의논문)
- Files in This Item
- There are no files associated with this item.
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