Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability
| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | 전영두 | - |
| dc.contributor.author | 백경욱 | - |
| dc.date.accessioned | 2013-03-16T08:12:12Z | - |
| dc.date.available | 2013-03-16T08:12:12Z | - |
| dc.date.created | 2012-02-06 | - |
| dc.date.issued | 2000-11-01 | - |
| dc.identifier.citation | 한국 마이크로 전자 및 패키징학회 추계 기술심포지움, v., no., pp.67 - 71 | - |
| dc.identifier.uri | http://hdl.handle.net/10203/129217 | - |
| dc.language | KOR | - |
| dc.publisher | 한국 마이크로 전자 및 패키징학회 | - |
| dc.title | Studies on Ni-Sn Intermetallic Compound and P-rich Ni Layer at the Electroless Nickel (NiP)-Solder Interface and Their Effects on Flip Chip Solder Joint Reliability | - |
| dc.type | Conference | - |
| dc.type.rims | CONF | - |
| dc.citation.beginningpage | 67 | - |
| dc.citation.endingpage | 71 | - |
| dc.citation.publicationname | 한국 마이크로 전자 및 패키징학회 추계 기술심포지움 | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.identifier.conferencecountry | South Korea | - |
| dc.contributor.localauthor | 백경욱 | - |
| dc.contributor.nonIdAuthor | 전영두 | - |
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