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| Effects of composition and thickness of TiN metal gate on the equivalent oxide thickness and flat-band voltage in metal oxide semiconductor devices Lee, Seok-Hee; Choi, Rino; Choi, Changhwan, MICROELECTRONIC ENGINEERING, v.109, pp.160 - 162, 2013-09 |
| Effects of compositional and structural change on the corrosion behaviour of nitrogen implanted Zircaloy-4 Lee, SJ; Kwon, Hyuk-Sang; Kim, W; Choi, BH, MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, v.263, no.1, pp.23 - 31, 1999-04 |
| Effects of Compositional Variablesand Heat-Treatment Conditions on Magnetic Properties of Sm2 (Co, Fe, Cu, Zr)17-Type Permanent Magnets W.Y. Jeung; K.B. Kim; Yoon Young Ku, 대한금속·재료학회지, v.24, no.3, pp.246, 1986 |
| Effects of compression and controlled selenization on powder-fabricated Cu (In,Ga)Se-2 thin films Song, Bong-Geun; Ahn, Hak-Young; Park, Bo-In; Park, Hyung-Ho; Ju, Byeong-Kwon; Lee, Seung Yong; Park, Jong-Ku; et al, APPLIED SURFACE SCIENCE, v.475, pp.158 - 161, 2019-05 |
| Effects of compressive stress on the nonlinear electromechanical behavior of ferroelectric ceramics Li, F; Fang, DN; Lee, Jungju; Kim, HC, SCIENCE IN CHINA SERIES E-ENGINEERING & MATERIALS SCIENCE, v.49, no.1, pp.29 - 37, 2006-02 |
| Effects of Conductive Particles on the Electrical Stability and Reliability of Anisotropic Conductive Film Chip-On-Board Interconnections Chung, Chang-Kyu; Sim, Gidong; Lee, Soon-Bok; Paik, Kyung-Wook, IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, v.2, no.3, pp.359 - 366, 2012-03 |
| Effects of conductivity and dielectric behaviors on the electrorheological response of a semiconductive poly(p-phenylene) suspension Chin, BD; Lee, YS; Park, OOk, JOURNAL OF COLLOID AND INTERFACE SCIENCE, v.201, no.2, pp.172 - 179, 1998-05 |
| Effects of coordinate system and position of AR notification while walking Lee, Hyunjin; Bang, Sunyoung; Woo, Woontack, VIRTUAL REALITY, v.27, no.2, pp.829 - 848, 2023-06 |
| Effects of Copper Doping on the Electronic Properties of CdS Films Sintered with CdCl2 J.T.Moon; Lim, Ho Bin, JOURNAL OF MATERIALS SCIENCE, v.23, pp.3475, 1988 |
| Effects of core/shell volumetric ratio on the dielectric-temperature behavior of BaTiO3 Jeon, Sang-chae; Yoon, Byung-kwon; Kim, Kwan-Hyeong; Kang, Suk-Joong L, JOURNAL OF ADVANCED CERAMICS, v.3, no.1, pp.76 - 82, 2014-03 |
| Effects of corona discharge ions on the synthesis of silver nanoparticles by a supersonic nozzle expansion method Jung, Jae Hee; Park, Hyung Ho; Kim, Sang Soo, JOURNAL OF VACUUM SCIENCE & TECHNOLOGY B, v.25, pp.169 - 174, 2007-01 |
Effects of Corporate Social Responsibility Actions on South Korean Adolescents' Perceptions in the Food Industry Lim, Mi-Hee; Kang, Yeong Seon; Kim, Yura, SUSTAINABILITY, v.9, no.2, 2017-02 |
| Effects of CoZrNb surface morphology on magnetic properties and grain isolation of CoCrPtO perpendicular recording media Hong, DH; Park, SH; Lee, Taek Dong, IEEE TRANSACTIONS ON MAGNETICS, v.41, pp.3148 - 3150, 2005-10 |
| Effects of Cr/Al underlayer on magnetic properties and crystallography in CoCrPtTa/Cr/Al thin films Chang, HS; Shin, KH; Lee, Taek Dong; Park, Joong Keun, IEEE TRANSACTIONS ON MAGNETICS, v.32, no.5, pp.3617 - 3619, 1996-09 |
| Effects of Cr2N on the pitting corrosion of high nitrogen stainless steels Ha, H; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.52, pp.2175 - 2180, 2007-01 |
| Effects of CrMo spacer layer on thermal stability and magnetic properties in an antiferromagnetically coupled medium Lee, Taek Dong, JOURNAL OF APPLIED PHYSICS, v.93, no.10, pp.7771 - 7773, 2003-05 |
| Effects of crosstalk in WDM systems using spectrum-sliced light sources Jang, YS; Lee, Chang-Hee; Chung, YC, IEEE PHOTONICS TECHNOLOGY LETTERS, v.11, no.6, pp.715 - 717, 1999-06 |
| Effects of Crystallinity and Molecular Weight on the Melting Behavior and Cell Morphology of Expanded Polypropylene in Bead Foam Manufacturing Jang, Byung Kak; Kim, Mun Ho; Park, O. Ok, MACROMOLECULAR RESEARCH, v.28, no.4, pp.343 - 350, 2020-04 |
| Effects of Cu addition on the creep rupture properties of a 12% Cr steel Ku, BS; Yu, Jin, SCRIPTA MATERIALIA, v.45, no.2, pp.205 - 211, 2001-07 |
| Effects of Cu and Pd addition on au bonding wire/Al pad interfacial reactions and bond reliability Gam, SA; Kim, HJ; Cho, JS; Park, YJ; Kim,SH; Moon, JT; Paik, Kyung-Wook, JOURNAL OF ELECTRONIC MATERIALS, v.35, pp.2048 - 2055, 2006-11 |
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