1 | 50Pb50In wt% 소더의 Cu, Ni 기판 위에서의 wetting 특성 = Wetting characteristics of 50Pb50In wt% solder on Cu, Ni substrateslink 정영희; Jung, Young-Hy; 유진; 전덕영; et al, 한국과학기술원, 1998 |
2 | (A) study on the interfacial reaction between lead-free solders and electroplated Ni or Cu metallization and its effect on mechanical reliability = 무연솔더와 전기도금된 니켈 및 구리와의 계면반응과 기계적 신뢰성에 미치는 영향에 관한 연구link Kim, Jong-Yeon; 김종연; et al, 한국과학기술원, 2008 |
3 | Activation of Ni Particles into Single Ni-N Atoms for Efficient Electrochemical Reduction of CO2 Fan, Qun; Hou, Pengfei; Choi, Changhyeok; Wu, Tai-Sing; Hong, Song; Li, Fang; Soo, Yun-Liang; et al, ADVANCED ENERGY MATERIALS, v.10, no.5, 2020-02 |
4 | Combined reforming of methane over supported Ni catalysts Roh, Hyun-Seog; Koo, Kee Young; Jeong, Jin Hyeok; Seo, Yu Taek; Seo, Dong Joo; Seo, Yong-Seog; Yoon, Wang Lai; et al, CATALYSIS LETTERS, v.117, no.1-2, pp.85 - 90, 2007-08 |
5 | Fabrication Process and Electromagnetic Wave Absorption Characterization of a CNT/Ni/Epoxy Nanocomposite Ryu, Seongwoo; Mo, Chan Bin; Lee, Haeshin; Hong, Soon-Hyung, JOURNAL OF NANOSCIENCE AND NANOTECHNOLOGY, v.13, no.11, pp.7669 - 7674, 2013-11 |
6 | High-Throughput Screening for the Promoters of Alumina Supported Ni Catalysts in Autothermal Reforming of Methane Lee, Won Su; Kim, Tae Yong; Woo, Seong-Ihl, TOPICS IN CATALYSIS, v.53, no.1-2, pp.123 - 128, 2010-02 |
7 | Mechanism of facet formation on Ni surfaces by sputtering with oxygen ion beams kyung joon kim; Jung, Kyung Hoon, SURFACE AND INTERFACE ANALYSIS, v.26, no.3, pp.224 - 232, 1998 |
8 | Ni 기판 위의 BaO 완충층 제작과 SmBCO superconducting grain boundary의 특성 = Fabrication BaO buffer layer on the Ni substrates and properties of the superconductng SmBCO grain boundarylink 임선미; Lim, Sun-Me; et al, 한국과학기술원, 2002 |
9 | Photoelectrochemical analysis of passive films formed on Ni and its alloys and its application to their corrosion behaviors Jang, HeeJin; Kwon, HyukSang, JOURNAL OF SOLID STATE ELECTROCHEMISTRY, v.19, no.12, pp.3427 - 3438, 2015-12 |
10 | Photoelectrochemical analysis on the passive film formed on Ni in pH 8.5 buffer solution Jang, HJ; Park, CJ; Kwon, Hyuk-Sang, ELECTROCHIMICA ACTA, v.50, pp.3503 - 3508, 2005-05 |
11 | Polymerization of ethylene using unsymmetric (α-Diimine)Ni(Ⅱ) and Pd(Ⅱ) catalysts = 비대칭 다이이민 니켈 및 팔라듐 촉매를 이용한 에틸렌 중합에 관한 연구link Park, Jae-Young; 박재영; et al, 한국과학기술원, 2008 |
12 | Repetitive grain growth behavior with increasing temperature and grain boundary roughening in a model nickel system Jung, Sang Hyun; Kang, Suk-Joong L., ACTA MATERIALIA, v.69, pp.283 - 291, 2014-05 |
13 | Selective CO adsorption using sulfur-doped Ni supported by petroleum-based activated carbon Kwon, Sunil; You, Youngwoo; Lim, Hyungseob; Lee, Jinhee; Chang, Tae-Sun; Kim, Yejin; Lee, Hyunjoo; et al, JOURNAL OF INDUSTRIAL AND ENGINEERING CHEMISTRY, v.83, pp.289 - 296, 2020-03 |
14 | Sn 솔더볼과 Ni 기판간의 계면 현상 및 열역학적 고찰 = Thermodynamic study and the interfacial phenomena of the Sn solder ball on the Ni substratelink 김종훈; Kim, Jong-Hoon; et al, 한국과학기술원, 2000 |
15 | 단순한 봉형상 및 모양변화를 보이는 봉형상 초합금 주물의 일방향 주조시 응고해석 = A numerical analysis for directional solidification of simple and complex rod shape superalloy castinglink 최윤석; Choi, Yun-Suk; et al, 한국과학기술원, 1998 |
16 | 저압 다이아몬드 합성에서 Ni, Fe, Co, Pd 기판에서 형성되는 soot 형성기구와 합성 조건에 따른 다이아몬드의 성장 모양 변화 = Mechanism of soot-formation on Ni, Fe, Co and Pd substrates, and morphology variation of diamond with deposition conditions in CVD of diamondlink 허종무; Huh, Jong-Moo; et al, 한국과학기술원, 2000 |
17 | 표면 산화층이 서브마이크론 크기 니켈의 소결거동에 미치는 영향 = Effect of passivation on the sintering behavior of submicron nickel powder compactslink 조기영; Jo, Gi-Young; et al, 한국과학기술원, 2013 |