Browse by Type Conference
Showing results 59421 to 59440 of 109501
| Noise control of zones: its theory and applications Jin-Young Park; Min-Ho Song; Jung-Min Lee; Tae-Woong Lee; Ji-Ho Chang; Kim, Yang-Hann, InterNoise 2010, Institute of Noise Control Engineering, 2010-06-16 |
| Noise Coupling Analysis between TSV and Active Circuit Kim, Joungho; Jonghyun Cho, 2012 IEEE Electrical Design of Advanced Package & Systems Symposium, EDAPS2012, 2012-12-10 |
| Noise coupling analysis method for an electronic safety and arming device (ESAD) Kang, Hyungmin; Kim, Subin; Lho, Daehwan; Park, Hyunwook; Sim, Boogyo; Kim, Joungho, 2019 Electrical Design of Advanced Packaging and Systems Symposium, EDAPS 2019, Institute of Electrical and Electronics Engineers Inc., 2019-12 |
| Noise Coupling and Shielding in Through-Silicon Via (TSV)-based 3D IC Cho, Jonghyun; Kim, Joohee; Pak, Jun So; Lee, Junho; Lee, Hyungdong; Park, Kunwoo, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011 Asia-Pacific Symposium on Electromagnetic Compatibility, 2011-05-17 |
| Noise coupling emulation between TSV and active circuit through metal oxide patch Kim, Joungho; Jonghyun Cho; Jaemin Lim, 65th Electronic Components and Technology Conference (ECTC), 65th Electronic Components and Technology Conference (ECTC), 2015-05-28 |
| Noise Coupling Modeling and Analysis of Through Glass Via(TGV) Kim, Joungho; Kim, Jihye; Kim, Youngwoo; Cho, Jonghyun; Venky Sundaram; Rao Tummala, IEEE International 3D Systems Integration Conference (3DIC), IEEE International 3D Systems Integration Conference (3DIC), 2015-08-31 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Manho Lee; Jonghyun Cho; Joohee Kim; Jiseong Kim, ECTC Conference, ECTC Conference, 2012-05-29 |
| Noise Coupling of Through-Via in Silicon and Glass Interposer Kim, Joungho; Jonghyun Cho; Joohee Kim; Jiseoung Kim, 63rd Electronic Components and Technology Conference (ECTC), pp.1806 - 1810, ECTC2013, 2013-05-19 |
| Noise coupling path analysis for RF interference caused by LCD noise modulation Hwang, Chulsoon; Kong, Sunkyu; Enomoto, Takashi; Maeshima, Junji; Araki, Kenji; Pommerenke, David; Fan, Jun, 2016 IEEE International Symposium on Electromagnetic Compatibility, EMC 2016, pp.348 - 352, Institute of Electrical and Electronics Engineers Inc., 2016-07 |
| Noise coupling to signal trace and via from power/ground simultaneous switching noise in high speed double data rates memory module Park, J.; Kim, H.; Pak, J.S.; Jeong, Y.; Baek, S.; Kim, Joungho; Lee, J.-J.; et al, 2004 International Symposium on Electromagnetic Compatibility, EMC 2004, pp.592 - 597, IEEE, 2004-08-09 |
| Noise Dissipation induced by substructures and distribution of vibratory energy in a complex system Choi, S.-H; Kim, Yang-Hann, 143rd Meeting Acoustical Society of America, v.111, no.5, 2002-05 |
| Noise Distribution Adaptive Self-Supervised Image Denoising using Tweedie Distribution and Score Matching Kim, Kwanyoung; Kwon, Taesung; Ye, Jong Chul, 2022 IEEE/CVF Conference on Computer Vision and Pattern Recognition, CVPR 2022, pp.1998 - 2006, IEEE Computer Society, 2022-06 |
| NOISE DISTRIBUTION CHANGE BY GAIN-SATURATED SEMICONDUCTOR OPTICAL AMPLIFIER Moon, Sang-Rok; Yoo, Sang-Hwa; Kye, Myeong-Gyun; Lee, Chang-Hee, OptoElectronics and Optical Communications Conference (OECC), pp.748 - 749, OECC, 2014-07-06 |
| Noise figure degradation analysis of power/ground noise on 900MHz LNA for UHF RFID Koo, K.; Park, H.; Shim, Y.; Kim, Joungho, 9th Electronics Packaging Technology Conference, EPTC 2007, pp.416 - 420, IEEE, 2007-12-12 |
| Noise Generation and Propagation from Subsonic Inviscid Flow past a Cone Kim, J. W.; Lee, Duck-Joo; Morris, P. J., IMA Conference on Computational Aeroacoustics, 2002-04 |
| Noise generation, coupling, isolation, and EM raidaiton in high-speed package and PCB Kim, Joungho; Pak, J.; Park, J.; Kim, H., IEEE International Symposium on Circuits and Systems 2005, ISCAS 2005, pp.5766 - 5769, IEEE, 2005-05-23 |
| Noise isolation in LTCC-based X/Ku-band transceiver SiP using double-stacked electromagnetic bandgap structure Park, J.; Kim, J.; Lu A.C.W.; Shim, Y.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
| Noise isolation modeling and experimental validation of power distribution network in chip-package Park, H.; Yoon, C.; Koo, K.; Kim, Joungho, IEEE International Symposium on Electromagnetic Compatibility, EMC 2007, pp.1 - 6, IEEE, 2007-07-09 |
| Noise Isolation Modeling of Partial EBG Power Bus using Segmentation Method and Cavity Model in Multi-layer PCBs Kim, Myunghoi; Koo, Kyoungchoul; Kim, Joungho, 2011 IEEE Electromagnetic Compatibility Symposium, 2011 IEEE Electromagnetic Compatibility Symposium, 2011-08-17 |
| Noise Parameter Extraction of GaAs MESFET with Monte-Carlo Simulation Hong, Songcheol; Back, JM; Kwon, YS, SSDM, pp.580 - 582, 1996 |
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